Radiation detector
First Claim
1. A method of producing a radiation detector comprising:
- forming an active matrix board including gate lines and data lines arrayed in a two-dimensional lattice shape, a plurality of high-speed switching elements provided at respective lattice points and connected to the gate lines and the data lines, each switching element being formed of polycrystalline silicon thin film transistor and having a source electrode, pixel electrodes connected to the source electrodes of the high-speed switching elements, and charge storage capacitances, each being disposed between the pixel electrode and a ground electrode, and forming a converting layer on the pixel electrodes at a temperature between 300°
C. and 800°
C. to generate a pair of electron-hole by absorbing light or radiation.
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Abstract
In a method of producing a radiation detector, an active matrix board is formed to include gate lines and data lines arranged in a two-dimensional lattice shape, a plurality of high-speed switching elements provided to respective lattice points and connected to the gate lines and the data lines, picture element electrodes connected to source electrodes of the high-speed switching elements, and charge storage capacitances disposed between the picture element electrodes and ground on a insulating base plate. Then, a converting layer is formed at upper portions of the respective picture element electrodes at a temperature between 300° C. and 800° C. to generate a pair of electron-hole by absorbing light or radiation. The active matrix board is formed of a poly-silicon process board.
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Citations
5 Claims
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1. A method of producing a radiation detector comprising:
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forming an active matrix board including gate lines and data lines arrayed in a two-dimensional lattice shape, a plurality of high-speed switching elements provided at respective lattice points and connected to the gate lines and the data lines, each switching element being formed of polycrystalline silicon thin film transistor and having a source electrode, pixel electrodes connected to the source electrodes of the high-speed switching elements, and charge storage capacitances, each being disposed between the pixel electrode and a ground electrode, and forming a converting layer on the pixel electrodes at a temperature between 300°
C. and 800°
C. to generate a pair of electron-hole by absorbing light or radiation. - View Dependent Claims (2, 3, 4, 5)
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Specification