Light emitting diodes packaged for high temperature operation
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Accused Products
Abstract
In accordance with the invention, an LED packaged for high temperature operation comprises a metal base including an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer, and a LED die mounted overlying the metal base. The LED is thermally coupled through the metal base to the thermal connection pad, and the electrodes are electrically connected to the underlying electrical connection pads. A low thermal resistance insulating layer can electrically insulate other areas of die from the base while permitting heat passage. Heat flow can be enhanced by thermal vias to the thermal connector pad. Ceramic layers formed overlying the base can add circuitry and assist in distributing emitted light. The novel package can operate at temperatures as high as 250° C.
102 Citations
20 Claims
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1-10. -10. (canceled)
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11. A low temperature co-fired on metal (LTCC-M) light emitting diode (LED) assembly for high temperature operation comprising:
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a metal base, the metal base including a thermal connection surface;
at least one LED die, the LED die having a pair of electrodes overlying and electrically insulated from the metal base, the die thermally coupled through the metal base to the thermal connection surface;
a layer of ceramic overlying the metal base, the layer of ceramic having at least one opening to house the LED die; and
a plurality of conductive traces insulated from the metal base, the LED electrodes electrically connected to the conductive traces.
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14. The LED assembly of claim 0 wherein the decoder/driver electronics that control the LED electrodes is embedded in the LTCC-M package.
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17. The LED assembly of claim 0 wherein the flip-chip is bonded to the traces by conductive balls comprising solder or gold.
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20. The LED assembly of claims 0 and 0 further comprising vias in the insulating layer, the vias electrically connecting traces to the isolated terminals.
Specification