Apparatus and methods for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer
First Claim
1. In combination, a network analyzer and an electrical component device under test using the network analyzer, the combination comprising:
- a network analyzer comprising;
a first port;
a second port;
a coaxial probe connected to one of the first port and the second port for establishing electrical contact on one or more electrical leads of an electrical component device under test; and
an electrical component device under test comprising;
a substrate;
a plurality of leads formed on said substrate, each lead of said plurality of leads at least including a conductive trace formed on a surface of said substrate, a conductive via extending through said substrate having one end thereof electrically connected to said conductive trace, and a ball lead formed on an opposing surface of said substrate and in electrical communication with an opposing end of said conductive via; and
a central conductive plane formed on at least a portion of said surface of said substrate, said conductive trace of at least one lead of said plurality of leads electrically connected to said central conductive plane.
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Accused Products
Abstract
Apparatus and methods are provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used to measure the parasitic capacitance and inductance of one or more I/O leads of an integrated circuit package, the measured parasitic capacitances and inductances providing an indication of the susceptibility of the integrated circuit package to mutual coupling between electrical leads of the package or between an electrical lead and other components of the integrated circuit package.
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Citations
22 Claims
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1. In combination, a network analyzer and an electrical component device under test using the network analyzer, the combination comprising:
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a network analyzer comprising;
a first port;
a second port;
a coaxial probe connected to one of the first port and the second port for establishing electrical contact on one or more electrical leads of an electrical component device under test; and
an electrical component device under test comprising;
a substrate;
a plurality of leads formed on said substrate, each lead of said plurality of leads at least including a conductive trace formed on a surface of said substrate, a conductive via extending through said substrate having one end thereof electrically connected to said conductive trace, and a ball lead formed on an opposing surface of said substrate and in electrical communication with an opposing end of said conductive via; and
a central conductive plane formed on at least a portion of said surface of said substrate, said conductive trace of at least one lead of said plurality of leads electrically connected to said central conductive plane. - View Dependent Claims (2, 3, 4)
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5. In combination, a network analyzer and an electrical component device under test using the network analyzer, the combination comprising:
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a network analyzer comprising;
a first port;
a second port;
a coaxial probe connected to one of the first port and the second port for establishing electrical contact on one or more electrical leads of an electrical component device under test; and
an electrical component device under test comprising;
a lead frame comprising;
a die-attach pad; and
a plurality of leads extending outwardly from said die-attach pad, each lead of said plurality of leads comprising a conductor having a bond end located proximate said die-attach pad and an opposing end; and
a central conductive plane formed on at least a portion of a surface of said die-attach pad, said bond end of said conductor of at least one lead of said plurality of leads electrically connected to said central conductive plane. - View Dependent Claims (6, 7)
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8. In combination, a network analyzer and an electrical component device under test using the network analyzer, the combination comprising:
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a network analyzer comprising;
a first port;
a second port;
a coaxial probe connected to one of the first port and the second port for establishing electrical contact on one or more electrical leads of an electrical component device under test; and
an electrical component device under test comprising;
a die-attach pad;
a plurality of leads extending outwardly from said die-attach pad, each lead of said plurality of leads comprising a conductor having a bond end located proximate said die-attach pad and an opposing end; and
a central conductive plane formed on at least a portion of a surface of said die-attach pad, said bond end of at least one lead of said plurality of leads electrically connected to said central conductive plane. - View Dependent Claims (9, 10, 11)
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12. In combination, a network analyzer and an electrical component device under test using the network analyzer, the combination comprising:
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a network analyzer for measuring the parasitic inductance of a lead of an integrated circuit comprising;
a first port;
a second port; and
a coaxial probe connected to one of the first port and the second port for establishing electrical contact on one or more electrical leads of an electrical component device under test;
an electrical component device under test comprising;
a substrate;
a plurality of leads formed on said substrate, each lead of said plurality of leads at least including a conductive trace formed on a surface of said substrate, a conductive via extending through said substrate having one end thereof electrically connected to said conductive trace, and a ball lead formed on an opposing surface of said substrate and in electrical communication with an opposing end of said conductive via; and
a central conductive plane formed on at least a portion of said surface of said substrate, said conductive trace of at least one lead of said plurality of leads electrically connected to said central conductive plane; and
a chart from the network analyzer for the parasitic inductance of a lead of an integrated circuit of the electrical component device under test. - View Dependent Claims (13, 14, 15)
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16. In combination, a network analyzer and an electrical component device under test using the network analyzer, the combination comprising:
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a network analyzer for measuring the parasitic inductance of a lead comprising;
a first port;
a second port; and
a coaxial probe connected to one of the first port and the second port for establishing electrical contact on one or more electrical leads of an electrical component device under test;
an electrical component device under test comprising;
a lead frame comprising;
a die-attach pad;
a plurality of leads extending outwardly from said die-attach pad, each lead of said plurality of leads comprising a conductor having a bond end located proximate said die-attach pad and an opposing end; and
a central conductive plane formed on at least a portion of a surface of said die-attach pad, said bond end of said conductor of at least one lead of said plurality of leads electrically connected to said central conductive plane; and
a chart from the network analyzer for the parasitic inductance of a lead of an integrated circuit of the electrical component device under test. - View Dependent Claims (17, 18)
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19. In combination, a network analyzer and an electrical component device under test using the network analyzer, the combination comprising:
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a network analyzer comprising;
a first port;
a second port; and
a coaxial probe connected to one of the first port and the second port for establishing electrical contact on one or more electrical leads of an electrical component device under test;
an electrical component device under test comprising;
a die-attach pad;
a plurality of leads extending outwardly from said die-attach pad, each lead of said plurality of leads comprising a conductor having a bond end located proximate said die-attach pad and an opposing end; and
a central conductive plane formed on at least a portion of a surface of said die-attach pad, said bond end of at least one lead of said plurality of leads electrically connected to said central conductive plane; and
a chart from the network analyzer for the parasitic inductance of a lead of an integrated circuit of the electrical component device under test. - View Dependent Claims (20, 21, 22)
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Specification