Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures
First Claim
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1. A method for forming a multilayer circuit device, comprising:
- providing a base substrate;
forming at least one conductor on the base substrate;
electroplating at least one sacrificial structure on at least one of the base substrate and conductors to define areas to be protected from deposition of a dielectric layer;
depositing a thin film of a predetermined material having a predetermined electrical or structural characteristic on at least a portion of the base substrate, the at least one conductor and the at least one electroplated sacrificial structure; and
removing the sacrificial structures to leave a patterned deposited thin film of the predetermined material on the conductors and the base substrate.
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Abstract
A multilayer circuit includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by electroplating techniques. Substrates formed in this manner enable significant increases in circuit pattern miniaturization, circuit pattern reliability, interconnect density and significant reduction of over-all substrate thickness.
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Citations
31 Claims
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1. A method for forming a multilayer circuit device, comprising:
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providing a base substrate;
forming at least one conductor on the base substrate;
electroplating at least one sacrificial structure on at least one of the base substrate and conductors to define areas to be protected from deposition of a dielectric layer;
depositing a thin film of a predetermined material having a predetermined electrical or structural characteristic on at least a portion of the base substrate, the at least one conductor and the at least one electroplated sacrificial structure; and
removing the sacrificial structures to leave a patterned deposited thin film of the predetermined material on the conductors and the base substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A multilayer circuit device, comprising:
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a base substrate;
at least one conductor formed on the base substrate; and
a patterned thin film of a predetermined material formed on the base substrate and the conductor, the predetermined material having been patterned by a pattern of electroplated sacrifical structures that were removed to form a predefined pattern in the thin film of predetermined material. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A sensor device having a multilayer circuit, the sensor device comprising:
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a base substrate;
at least one conductor formed on the base substrate;
a patterned thin film of a predetermined material formed on the base substrate and the conductor, the predetermined material having been patterned by a pattern of electroplated sacrifical structures that were removed to form a predefined pattern in the thin film of predetermined material;
wherein the patterned thin film material forms at least part of a sensor circuit. - View Dependent Claims (26, 27, 28, 29, 30, 31)
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Specification