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Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures

  • US 20050161826A1
  • Filed: 03/22/2005
  • Published: 07/28/2005
  • Est. Priority Date: 09/27/2002
  • Status: Active Grant
First Claim
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1. A method for forming a multilayer circuit device, comprising:

  • providing a base substrate;

    forming at least one conductor on the base substrate;

    electroplating at least one sacrificial structure on at least one of the base substrate and conductors to define areas to be protected from deposition of a dielectric layer;

    depositing a thin film of a predetermined material having a predetermined electrical or structural characteristic on at least a portion of the base substrate, the at least one conductor and the at least one electroplated sacrificial structure; and

    removing the sacrificial structures to leave a patterned deposited thin film of the predetermined material on the conductors and the base substrate.

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