Temperature compensation for silicon MEMS resonator
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Abstract
Thermally induced frequency variations in a micromechanical resonator are actively or passively mitigated by application of a compensating stiffness, or a compressive/tensile strain. Various composition materials may be selected according to their thermal expansion coefficient and used to form resonator components on a substrate. When exposed to temperature variations, the relative expansion of these composition materials creates a compensating stiffness, or a compressive/tensile strain.
56 Citations
35 Claims
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1-23. -23. (canceled)
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24. A micromechanical resonator, comprising:
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a substrate formed from a first material having a first thermal expansion coefficient;
an oscillating beam formed from an active layer deposited over the substrate, wherein the active layer is formed from;
(1) a second material having a second thermal expansion coefficient which is different from the first thermal expansion coefficient and (2) a third material having a third thermal expansion coefficient which is different from the second thermal expansion;
a first anchor structure and a second anchor structure; and
wherein the first and second anchor structures are laterally disposed one from the other on the substrate in relation to the oscillating beam to support the oscillating beam above the substrate. - View Dependent Claims (25, 26, 27, 28)
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29. A micromechanical resonator, comprising:
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a substrate formed from a first material having a first thermal expansion coefficient;
a beam formed from a second material having a second thermal expansion coefficient which is different from the first thermal expansion coefficient, wherein the beam is suspended above the substrate by at least one anchor structure;
wherein the at least one anchor structure further comprises;
an anchor point fixing the anchor to the substrate; and
,a composite anchor structure formed from the second material and a third material, wherein the third material includes a third thermal expansion coefficient which is different from the second thermal expansion coefficient. - View Dependent Claims (32, 33, 34, 35)
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30-31. -31. (canceled)
Specification