Architecture for power modules such as power inverters
First Claim
Patent Images
1. A power converter, comprising:
- a first phase terminal; and
at least two switch modules, each of the switch modules comprising;
a housing forming an interior compartment;
a conductive base plate;
a number of switches, each of the switches comprising a first active terminal, a second active terminal, and a control terminal, the first active terminals surface mounted to the conductive base plate;
a conductive member supported by the housing, the conductive member comprising at least one portion extending externally from the housing and at least one portion extending internally in the interior compartment of the housing; and
a number of wire bonds electrically coupling the second active terminal of the switches to the portion of the conductive member that extends internally in the interior compartment of the housing;
wherein the conductive base plate of a first one of the switch modules comprises an upright portion extending at an approximately right angle with respect to the respective conductive base plate, and the conductive member of a second one of the switch modules comprises an upright portion extending at an approximately right angle with respect to the respective conductive base plate, and wherein the upright portions of the first and the second ones of the switch modules are parallel to each other and are electrically connected to the first phase terminal.
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Accused Products
Abstract
Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.
61 Citations
20 Claims
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1. A power converter, comprising:
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a first phase terminal; and
at least two switch modules, each of the switch modules comprising;
a housing forming an interior compartment;
a conductive base plate;
a number of switches, each of the switches comprising a first active terminal, a second active terminal, and a control terminal, the first active terminals surface mounted to the conductive base plate;
a conductive member supported by the housing, the conductive member comprising at least one portion extending externally from the housing and at least one portion extending internally in the interior compartment of the housing; and
a number of wire bonds electrically coupling the second active terminal of the switches to the portion of the conductive member that extends internally in the interior compartment of the housing;
wherein the conductive base plate of a first one of the switch modules comprises an upright portion extending at an approximately right angle with respect to the respective conductive base plate, and the conductive member of a second one of the switch modules comprises an upright portion extending at an approximately right angle with respect to the respective conductive base plate, and wherein the upright portions of the first and the second ones of the switch modules are parallel to each other and are electrically connected to the first phase terminal. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A power converter, comprising:
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at least a first switch module comprising;
a first housing of an electrically insulative material forming an interior and an exterior, the interior of the first housing open to the exterior at a first end and at a second end;
a first conductive base plate comprising a first surface and a second surface opposed to the first surface;
a first number of semiconductor switches each comprising a first active terminal, a second active terminal and a control terminal, the first active terminal of each of the first number of semiconductor switches surface mounted to the first surface of the first conductive base plate wherein the first conductive base plate is coupled to the first housing such that the first conductive base plate closes the opening at the second end of the first housing with the first number of semiconductor switches disposed in the interior of the first housing and the second surface of the first conductive base plate is exposed to the exterior of the first housing to transfer heat from the first housing;
a first conductive member supported by the first housing, the first conductive member comprising an exterior portion extending from the first housing into the exterior, a perimeter portion forming at least one shelf extending from the first housing into the interior of the first housing, and an upright portion extending upright with respect to the first surface of the first conductive base plate from the first housing into the exterior; and
a number of wire bonds electrically coupling the second active terminal of each of the first number of semiconductor switches to the shelf of the first conductive member;
at least a second switch module comprising;
a second housing of an electrically insulative material forming an interior and an exterior, the interior of the second housing open to the exterior at a first end and at a second end;
a second conductive base plate comprising a first surface, a second surface opposed to the first surface, and an upright portion extending upright with respect to the first surface of the second conductive base plate from the second housing into the exterior;
a second number of semiconductor switches each comprising a first active terminal, a second active terminal and a control terminal, the first active terminal of each of the second number of semiconductor switches surface mounted to the first surface of the second conductive base plate wherein the second conductive base plate is coupled to the second housing such that the second conductive base plate closes the opening at the second end of the second housing with the second number of semiconductor switches disposed in the interior of the second housing and the second surface of the second conductive base plate is exposed to the exterior of the second housing to transfer heat from the second housing;
a second conductive member supported by the second housing, the second conductive member comprising an exterior portion extending from the second housing into the exterior and a perimeter portion forming at least one shelf extending from the second housing into the interior of the second housing; and
a number of wire bonds electrically coupling the second active terminal of each of the second number of semiconductor switches to the shelf of the second conductive member; and
a first terminal, wherein the first conductive base plate of the first switch module and the second conductive member of the second switch module are electrically coupled to the first terminal. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification