Method for processing data based on the data context

• US 20050165731A1
• Filed: 02/15/2005
• Published: 07/28/2005
• Est. Priority Date: 08/20/2002
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Funk, Merritt
• Granted Patent: US 7,395,131 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G05B 15/02 electric
• CPC Class Codes: G05B 19/41865 characterised by job scheduling, process planning, material flow
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G05B 2219/32128 Gui graphical user interface
• CPC Class Codes: G05B 2219/33054 Control agent, an active logical entity that can control logical objects
• CPC Class Codes: G05B 2219/33055 Holon, agent executes task and cooperates with other, distributed control
• CPC Class Codes: G05B 2219/35504 Multilingual communication, messages in different languages
• CPC Class Codes: G05B 2219/36284 Use of database for machining parameters, material, cutting method, tools
• CPC Class Codes: G05B 2219/42001 Statistical process control spc
• CPC Class Codes: G05B 23/0224 Process history based detection method, e.g. whereby history implies the availability of large amounts of data
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
• CPC Class Codes: Y02P 90/80 Management or planning

Abstract

A method for managing data in a semiconductor processing environment. Raw data is collected during a process. Also, trace file data and process log file data are received. The raw data is synchronized with the trace file data and process log file data to create wafer data summary data is calculated from the raw data and a file is created containing the wafer data and the summary data.

Claims

1. A method for managing data in a semiconductor processing environment, the method comprising:

collecting raw data during a process;

receiving trace file data and process log file data;

synchronizing the raw data with the trace file data and process log file data to create wafer data;

calculating summary data from the raw data; and

creating a file containing the wafer data and the summary data.

2. The method as claimed in claim 1, further comprising:

executing at least one analysis strategy; and

executing at least one of an analysis plan, a SPC plan, a PLS plan, a PCA plan, a raw file output plan, a summary file output plan, and judgment plan.

3. The method as claimed in claim 2, further comprising storing the wafer data in an SQL database.

4. The method as claimed in claim 2, further comprising executing at least one of a data backup function, a data archive function, a data delete function, a data recover function, and a data restore function.

5. The method as claimed in claim 2, further comprising at least one of:

displaying status data using at least one GUI screen, displaying setup data using at least one GUI screen, displaying configuration data using at least one GUI screen;

displaying wafer data using at least one GUI screen, and displaying trace parameter data using at least one GUI screen.

6. The method as claimed in claim 1, wherein the collecting of raw data comprises:

receiving context information;

executing a data collection strategy based on the context information; and

executing a data collection plan based on the data collection strategy.

7. The method as claimed in claim 6, wherein the executing of a data collection plan comprises:

receiving context information;

executing a data collection strategy based on the context information; and

executing a data collection plan based on the data collection strategy.

8. The method as claimed in claim 1, wherein the executing of a data collection plan comprises:

receiving a start_event;

collecting the raw data using at least one sensor;

storing the raw data in a raw data collection file; and

receiving an end_event, wherein the at least one sensor is stopped and the raw data collection file is closed.

9. The method as claimed in claim 1, wherein the synchronizing of the raw data with the trace file data and process log file data to create wafer data comprises indexing data from at least one sensor into at least one table using a start_event and runtime steps, wherein the data comprises at least one of raw data, trace file data, and process log file data.

10. The method as claimed in claim 1, wherein the collecting of raw data comprises:

executing a data collection plan and data preprocessing plan;

initializing a plurality of sensors using a sensor setup plan;

determining a time synchronization definition for indexing data;

starting a sensor, wherein the sensor comprises at least one of a process tool, a process module, and a process sensor;

receiving data from the sensor; and

storing the data from the sensor in at least one of a raw data collection file, a trace file, and a process log file using the time synchronization definition.

11. The method as claimed in claim 10, further comprising:

stopping the sensor;

transmitting the data from the sensor to a data collection hub; and

processing the data in the hub.

12. The method as claimed in claim 11, wherein the processing of the data in the hub further comprises:

calculating custom parameters;

calculating data summaries using the data collection plan;

filtering data using the data preprocessing plan; and

creating an SQL file containing raw data and summary data.

13. The method as claimed in claim 12, wherein the filtering of the data in the hub further comprises:

trimming data for a process step;

clipping data; and

counting spike limits.

14. The method as claimed in claim 10, further comprising:

processing the data; and

displaying at least some of the processed data.

15. The method as claimed in claim 14, wherein the displaying of at least some of the processed data further comprises:

creating a trace wafer chart; and

displaying the trace wafer chart using a GUI screen.

16. The method as claimed in claim 14, wherein the displaying of at least some of the processed data further comprises:

creating a summary wafer chart; and

displaying the summary wafer chart using a GUI screen.

17. The method as claimed in claim 14, wherein the displaying of at least some of the processed data further comprises:

creating a trace wafer step comparison chart; and

displaying the trace wafer step comparison chart using a GUI screen.

18. The method as claimed in claim 10, further comprising:

using a parameter saving screen to initialize at least one sensor, wherein the parameter saving screen comprises a list of parameters and means for saving at least one parameter.

19. The method as claimed in claim 18, wherein the parameter saving screen comprises a multi-level navigation tree.

20. The method as claimed in claim 19, wherein the multi-level navigation tree comprises at least one of an English language multi-level navigation tree, a Japanese language multi-level navigation tree, a Taiwanese language multi-level navigation tree, a Chinese language multi-level navigation tree, a Korean language multi-level navigation tree, a German language multi-level navigation tree, and a French language multi-level navigation tree.

21. The method as claimed in claim 18, wherein the parameter saving screen comprises a plurality of selection tabs.

22. The method as claimed in claim 21, wherein the plurality of selection tabs comprises at least one of left-to-right tabs, right-to-left tabs, top-to-bottom tabs, and bottom-to-top tabs.

23. The method as claimed in claim 14, wherein the displaying of at least some of the processed data further comprises:

creating tool status data; and

displaying the tool status data using a GUI screen.

24. The method as claimed in claim 1, further comprising:

creating system configuration data; and

displaying the system configuration data using a system configuration screen.

25. The method as claimed in claim 24, wherein the system configuration screen comprises a title panel, an information panel, and a navigation panel.

26. The method as claimed in claim 1, wherein the method comprises using at least one of an English language screen, a Japanese language screen, a Taiwanese language screen, a Chinese language screen, a Korean language screen, a German language screen, and a French language screen.

27. The method as claimed in claim 1, wherein the method comprises using a GUI screen comprising at least one of left-to-right selection tabs, right-to-left selection tabs, top-to-bottom selection tabs, and bottom-to-top selection tabs.

28. The method as claimed in claim 1, further comprising storing the wafer data using a data collection hub.

29. The method as claimed in claim 1, wherein the file containing the wafer data and the summary data is a SQL file.