Light emitting diode
First Claim
1. An LED comprising:
- a chip substrate formed with a die bond pattern and electrode terminals;
at least one LED chip mounted on the chip substrate;
a reflective frame arranged on the chip substrate to enclose the circumference of the LED chip and having an opening on one part of its side walls and on its upper surface;
reflecting surfaces formed on the inner circumferential surfaces of the side walls of the reflective frame;
a light transmissive resin body formed in the reflective frame and using the opening in the side wall as a light emission face; and
a reflecting film covering the upper surface of the light transmissive resin body exposed on the upper surface side of the reflective frame;
wherein light produced by the LED chip is reflected by the reflecting surfaces of the reflective frame and by the reflecting film and is emitted outward from the light emission face.
1 Assignment
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Accused Products
Abstract
An LED comprises: a chip substrate formed with a die bond pattern and electrode terminals; an LED chip mounted on the chip substrate; a reflective frame arranged on the chip substrate to enclose a circumference of the LED chip and having an opening at a part of its side walls and on an upper surface; reflecting surfaces formed on inner circumferential surfaces of the side walls of the reflective frame; a light transmissive resin body formed in the reflective frame and using the opening in the side wall as a light emission face; and a reflecting film covering an upper surface of the light transmissive resin body exposed on an upper surface side of the reflective frame; wherein light produced by the LED chip is reflected by a reflecting surface of the refractive frame and by the reflecting film and is emitted outward from the light emission face. The side emission type LED of this construction can be reduced in thickness for surface mounting and can illuminate a small-width side surface of a liquid crystal panel with high efficiency.
85 Citations
9 Claims
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1. An LED comprising:
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a chip substrate formed with a die bond pattern and electrode terminals;
at least one LED chip mounted on the chip substrate;
a reflective frame arranged on the chip substrate to enclose the circumference of the LED chip and having an opening on one part of its side walls and on its upper surface;
reflecting surfaces formed on the inner circumferential surfaces of the side walls of the reflective frame;
a light transmissive resin body formed in the reflective frame and using the opening in the side wall as a light emission face; and
a reflecting film covering the upper surface of the light transmissive resin body exposed on the upper surface side of the reflective frame;
wherein light produced by the LED chip is reflected by the reflecting surfaces of the reflective frame and by the reflecting film and is emitted outward from the light emission face. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification