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Integrated circuit package with transparent encapsulant and method for making thereof

  • US 20050167790A1
  • Filed: 12/29/2004
  • Published: 08/04/2005
  • Est. Priority Date: 12/31/2003
  • Status: Abandoned Application
First Claim
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1. A method for making an IC package with transparent encapsulant, the method comprising:

  • providing a leadframe, the leadframe including a first die pad and a second die pad;

    disposing a first die on the first die pad and a second die on the second die pad;

    forming a cavity on the leadframe, the cavity including the first die pad and the second die pad;

    injecting an encapsulant material into the cavity;

    cutting the injected encapsulant material and the leadframe to form a first IC package and a second IC package;

    wherein;

    the encapsulant material is transparent for visible wavelengths; and

    the injecting an encapsulant material is performed at an encapsulant temperature ranging from 140°

    c to 160°

    c.

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