Electronic devices and its production methods
First Claim
1. An electronic device having mounted thereon a microelectromechanical system element comprising a micromachine component and electronic component for operation of said micromachine component formed on a substrate, in which an operating space for said micromachine component is defined by said substrate and a lid bonded covering an active surface of said substrate, and said electronic component and wiring patterns of said lid are electrically connected at a bonded part of said substrate and said lid.
2 Assignments
0 Petitions
Accused Products
Abstract
An electronic device having mounted thereon an MEMS element or other functional elements, in which a device body and lid define an element-carrying space, the element-carrying space is sealed air-tight by an ultrasonic bonded part bonding the device body and the lid, and the element-carrying space having arranged inside it a system element secured to the device body and/or the lid by flip-chip connection.
246 Citations
27 Claims
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1. An electronic device having mounted thereon a microelectromechanical system element comprising a micromachine component and electronic component for operation of said micromachine component formed on a substrate, in which
an operating space for said micromachine component is defined by said substrate and a lid bonded covering an active surface of said substrate, and said electronic component and wiring patterns of said lid are electrically connected at a bonded part of said substrate and said lid.
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10. A method of production of an electronic device having mounted thereon a microelectromechanical system element, which comprises the steps of:
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forming a micromachine component and electronic component for operation of said micromachine component on a substrate to form said system element; and
bonding to said substrate a lid covering an active surface of said substrate and provided with wiring patterns to define an operating space for said micromachine component and electrically connecting said electronic component and the wiring patterns of said lid at a bonded part of said substrate and said lid. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. An electronic device having mounted thereon a functional element, in which
an element-carrying space is defined by a device body and a lid covering the same, said device body and said lid are sealed air-tight by a continuous ultrasonic bonded part formed in contact with the outer periphery of said element-carrying space side of said members without interruption, said air-tightly sealed element-carrying space has arranged inside the space said functional element fixed to said device body and/or said lid, and said functional element is electrically connected to an outernal element and others.
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21. A method of production of an electronic device having mounted thereon a functional element, comprising:
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securing said functional element to a device body and/or lid; and
bonding said device body and said lid to define an element-carrying space, forming a continuous ultrasonic bonded part at said device body and said lid in contact with an outer periphery of said element-carrying space side of said members without interruption, and thereby sealing air-tightly said element-carrying space. - View Dependent Claims (22, 23, 24)
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- 25. A method of covering and securing a lid in an electronic device having mounted thereon a functional element, which comprises a step of forming securing regions in predetermined patterns at an outer periphery of a device body carrying said functional element, bringing corresponding parts of said lid into abutment with said securing regions, and sealing air-tight said device body and said lid by ultrasonic bonding.
Specification