Miniaturised surface mount optoelectronic component

• US 20050167796A1
• Filed: 01/29/2004
• Published: 08/04/2005
• Est. Priority Date: 01/29/2004
• Status: Abandoned Application

• Current Assignee: Kheng Chiong Tay, Khin Shin Lai, Tek Beng Low
• Original Assignee: Kheng Chiong Tay, Khin Shin Lai, Tek Beng Low
• Inventors: Tay, Kheng Chiong, Low, Tek Beng, Lai, Khin Shin
• Application Number:
  US10/765,841
• Publication Number:
  US 20050167796A1
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The invention relates to a miniaturised surface mount optoelectronic component. An electrically conductive material (1) preferably metal frame is used to serve as the base for the assembly. Optionally a cavity (2) may be formed within this electrically conductive base material to serve as a reflector cup. An optoelectronic chip (3) is mounted within this cavity. The whole base material is then encapsulated with a hard transparent or translucent resin material (4) so that optical radiation may be transmitted or received via this medium. Electrical connection(s) between the chip and the base material is provided by a metallic wire or wires (6).

Claims

1. An optoelectronic component based on a surface mount technology, said optoelectronic component comprising:

an electrically conductive frame to form a base for an assembly;

at least one optoelectronic chip mounted on said base;

an electrical connection between said optoelectronic chip and said electrically conductive frame by wiring means; and

soldering terminals which are part of said electrically conductive frame and are exposed at bottom and side portions of said component;

wherein said electrically conductive frame is encapsulated with a translucent material to enable optical radiation to be transmitted or received via said optoelectronic component; and

wherein said soldering terminals do not extend beyond an outline of said encapsulation material.

10. The optoelectronic component as claimed in claim 1, wherein said electrically conductive frame is made of a metal.

11. The optoelectronic component as claimed in claim 1, wherein a lens structure is incorporated as part of said encapsulation material.

12. The optoelectronic component as claimed in claim 1, wherein a multiple lens structure is incorporated as part of said encapsulation material.

13. The optoelectronic component as claimed in claim 1, wherein a cavity is formed within said electrically conductive frame and is used to attach said optoelectronic chip within said cavity and serve as a reflector.

14. The optoelectronic component as claimed in claim 1, wherein said electrically conductive frame is crafted with a series of grooves and wings to enhance anchorage and minimize an occurrence of de-lamination.

2-9. -9. (canceled)