Power module

• US 20050168197A1
• Filed: 11/28/2002
• Published: 08/04/2005
• Est. Priority Date: 02/01/2002
• Status: Active Grant

• Current Assignee: Conti Temic Microelectronic GmbH (Continental AG)
• Original Assignee: Conti Temic Microelectronic GmbH (Continental AG)
• Inventors: Graf, Werner, Wagner, Bernhard, Briggs, William T, Baeumel, Hermann, Kilian, Hermann, George, Dietrich
• Granted Patent: US 7,215,023 B2
• Time in Patent Office: Days
• US Class Current: 323/220
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/167 incorporating printed resistors

Abstract

Proposed is a simple, economical construction, which ensures a reliable operation, of the power module comprising at least one carrier body for mounting at least one power component. For this purpose, a hybrid circuit is arranged as a thick film circuit on at least one of the carrier bodies, and the hybrid circuit comprises at least one thick film resistor as a discharging resistor for discharging at least one component provided as an energy store. Power module as a power converter for electric motors.

Claims

1. Power module (1) with at least one carrier body (2) for mounting at least one power component (51) and with at least one component (52) as an energy store, characterized in that a hybrid circuit (8) is arranged as a thick film circuit on at least one of the carrier bodies (2), which hybrid circuit comprises at least one thick film resistor (53) as a discharging resistor for discharging the at least one component (52) provided as an energy store.

2. Power module according to claim 1, characterized in that the discharging resistor is divided into at least two parallel-connected partial resistors, and in that the partial resistors are arranged as thick film resistors (53) in at least one hybrid circuit (8) on at least one of the carrier bodies (2).

15. Power module according to claim 1, characterized in that a hybrid circuit (8) comprises a switching element (55) for the controlled activation of the discharging process for discharging the at least one component (52) provided as an energy store.

16. Power module according to claim 15, characterized in that the switching element (55) is embodied as a switching transistor.

17. Power module according to claim 1, characterized in that at least one hybrid circuit (8) comprises at least one sensor (54).

18. Power module according to claim 17, characterized in that, characterized in that, at least one hybrid circuit (8) comprises a temperature sensor (54) for thermal monitoring of the at least one power component (51).

19. Power module according to claim 1, characterized in that the at least one hybrid circuit (8) is contacted with the conductor path structure (3) on the top surface (21) of the carrier body (2) via bond wires (71).

20. Power module according to claim 1, characterized in that the at least one carrier body (2) consists of an insulating material with high thermal conductivity.

21. Power module according to claim 20, characterized in that the at least one carrier body (2) consists of a ceramic material.

22. Power module according to claim 1, characterized in that the at least one carrier body (2) is arranged on a cooling body (41).

23. Power module according to claim 22, characterized in that the cooling body (41) is connected to a cooling system (4).

24. Power module according to claim 23, characterized in that the cooling body (41) is integrated in a cooling circuit (43) of the cooling system (4).

25. Power module according to claim 22, characterized in that the cooling body (41) is connected with the bottom surface (22) of the carrier body (2) via a metallization layer.

26. Power module according to claim 1, characterized in that the conductor path structure (3) on the top surface (21) of the carrier body (2) comprises conductor paths (31), mounting surfaces (32) for mounting at least the power components (51), contact locations (33) for contacting at least the power components (51), and connection surfaces (34) for connecting contacting elements (71) and/or connection contacts (6).

3-14. -14. (canceled)