ID label, ID tag, and ID card

• US 20050168339A1
• Filed: 01/28/2005
• Published: 08/04/2005
• Est. Priority Date: 02/04/2004
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Arai, Yasuyuki, Akiba, Mai, Kanno, Yohei, Tachimura, Yuko
• Granted Patent: US 7,561,052 B2
• Time in Patent Office: Days
• US Class Current: 340/572.800
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags

Abstract

In commercial products to which a non-contact type or contact type ID label or ID tag is attached and ID cards, there is fear that, due to a difference between coefficients of thermal expansion between an antenna for communication and a resin provided around the antenna, stress is applied to the resin with the larger coefficient of thermal expansion to break the resin. This contributes to decrease in manufacturing yield, lifetime, and reliability of an ID label or the like. In an article such as an ID label, an ID tag, and an ID card according to the present invention, a filler is included in a filling layer provided around an antenna forming an ID label, an ID tag, and an ID card so that the difference in coefficient of thermal expansion between the antenna and the filling layer can be reduced. This makes it possible to ease generation of stress due to the difference in coefficient of thermal expansion and prevent peeling and cracks of the filling layer.

Claims

1. An article comprising:

an antenna;

a thin film integrated circuit device includig a thin film transistor and operationally connected to the antenna; and

a filling layer including a filler and provided around the antenna.

2. The article according to claim 1, wherein said article is an ID label.

3. The article according to claim 1, wherein said article is an ID card.

4. The article according to claim 1, wherein said article is an ID tag.

5. The article according to claim 2 further comprising a separator attached to the filling layer with an adhesive material layer interposed therebetween.

6. The article according to claim 1, wherein a coefficient of thermal expansion of the filling layer including the filler is less than or equal to twice a coefficient of thermal expansion of the antenna.

7. The article according to claim 1, wherein the filler functions to decrease or increase the coefficient of thermal expansion of the filling layer and reduces a difference in coefficient of thermal expansion from the antenna or a film forming the thin film transistor.

8. The article according to claim 1, wherein a shape of the filler is spherical or colomun-shaped

9. The article according to claim 1, wherein a protective film comprising a single layer or a laminate layer including at least one of silicon oxide, silicon nitride, SiOxNy (x>

y), and SiNxOy (x>

y) is formed at least above or below the thin film integrated circuit device.

10. The article according to claim 1, wherein at least one of hydrogen and halogen is included in a semiconductor film of the thin film transistor included in the thin film integrated circuit device at a concentration of from 1×

10¹⁹ to 5×

10²⁰ cm<sup>−

3</sup>.

11. The article according to claim 1, wherein a thickness of the thin film integrated circuit device is 0.1 to 3 μ

m.

12. The article according to claim 1, wherein the antenna comprises a material selected from of the group consisting of Ag, Au, Al, Cu, Zn, Sn, Ni, Cr, Fe, Co, Ti, and a combination thereof.

13. The article according to claim 1, wherein the filling layer includes a material selected from of the group consisting of a photosensitive organic material, a non-photosensitive organic material, and a heat-resistant organic resin.

14. The article according to claim 1, wherein the filler includes a material selected from of the group consisting of silica (SiO₂), alumina (Al₂O₃), boron nitride (BN), magnesia (magnesium oxide), aluminum nitride (AlN), silicon nitride, glass fiber, silicon oxide, carbon fiber, calcium carbonate, talc (talcan), mica, silver powder, copper powder, nickel powder, and copper powder coated with silver.

15. The article according to claim 2, wherein the adhesive material layer includes a material selected from of the group consisting of a cyanoacrylate material, a vinyl acetate resin emulsion, a rubber material, a vinyl chloride resin material, a vinyl acetate solution material, an epoxy material, and a hot-melt (thermal melting type) material.

16. The ID label according to claim 2, wherein the separator includes a material selected from of the group consisting of paper, synthetic paper, plastic, PET, polypropylene, polyethylene, polystyrene, nylon, and an inorganic material.

17. An article comprising:

a substrate;

an antenna over the substrate;

a thin film integrated circuit device including a thin film transistor and operationally connected to the antenna;

a connecting pad operationally connecting the antenna and the thin film integrated circuit;

a filling layer including a filler and provided around the antenna.

a wiring operationally connecting the thin film integrated circuit device and the antenna.

18. The article according to claim 17, wherein a coefficient of thermal expansion of the filling layer including the filler is less than or equal to twice a coefficient of thermal expansion of the antenna.

19. A method of manufacturing an article comprising the steps of:

forming an antenna over a substrate;

forming a thin film integrated circuit device;

forming a connecting pad operationally connecting the antenna and the thin film integrated circuit device over the substrate;

attaching the thin film integrated circuit device to the substrate; and

forming a filling layer including a filler and contacted with the substrate.

20. The method according to claim 19, wherein a coefficient of thermal expansion of the filling layer including the filler is less than or equal to twice a coefficient of thermal expansion of the antenna.

21. A method of manufacturing an article comprising the steps of:

forming an antenna over a first substrate;

forming a thin film integrated circuit device;

forming a connecting pad operationally connecting the antenna and the thin film integrated circuit device over the first substrate;

attaching the thin film integrated circuit device to the first substrate;

forming a first filling layer including a first filler;

attaching the first substrate to a second substrate with the first filling layer interposed therebetween;

forming a second filling layer including a second filler; and

attaching the second substrate to a third substrate with the second filling layer interposed therebetween.

22. The method according to claim 21, wherein a coefficient of thermal expansion of the first filling layer including the first filler and the second filling layer including the second filler is less than or equal to twice a coefficient of thermal expansion of the antenna.