Surface mount optoelectronic component

• US 20050168922A1
• Filed: 01/29/2004
• Published: 08/04/2005
• Est. Priority Date: 01/29/2004
• Status: Active Grant

• Current Assignee: Dominant OPTO Technologies Sendirian Berhad (D & O Ventures Berhad)
• Original Assignee: Dominant OPTO Technologies Sendirian Berhad (D & O Ventures Berhad)
• Inventors: Lai, Khin Shin, Tay, Kheng Chiong, Low, Tek Beng
• Granted Patent: US 7,696,526 B2
• Time in Patent Office: Days
• US Class Current: 361/679.20
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 7/1061 co-operating by abutting

Abstract

The invention relates to a surface mount optoelectronic component. A thick electrically conductive material (1) is used to serve as the base for the assembly. An opaque plastic material (2) is used to provide the housing for the whole component. A cavity (5) on the top surface is designed within the plastic material. An optoelectronic chip (3) is mounted within this cavity. This cavity is filled with a hard transparent or translucent resin material so that optical radiation may be transmitted or received via this window. Electrical connection(s) between the chip and the base material is provided by a metallic wire (4). Subsequent connections to the external sub-systems such as PCB are provided by the base material itself. No extra mechanical processes are necessary to create the connections. The base material extends all the way from the middle to the bottom (8) and to one of the side walls (7); until the extend of protruding outside the package. The bottom surface (8) will be used for connection when a top illuminator is required. Alternatively, the side surface (7) could be used for connection if the component is used as a side illuminator.

Claims

1. An optoelectronic component based on the surface mount technology, said component comprising

a electrically conductive material (1),

an opaque plastic material (2), and

a cavity (5),

wherein the said electrically conductive material (1) serves as a base for the assembly, the said opaque plastic material (2) provides a housing for the whole component, and the said cavity (5) is located within the plastic material where an optoelectronic chip (3) is mounted in.

2. An optoelectronic component as claimed in claim 1, wherein the cavity (5) is filled with a transparent and translucent resin material.

3. An optoelectronic component as claimed in claim 1, wherein electrical connection(s) between the chip (3) and the base material is provided with a metallic wire (4).

4. An optoelectronic component as claimed in claim 1, wherein initial base material provides connecting terminals to the external sub-systems such as PCBs.

5. An optoelectronic component as claimed in claim 1, wherein the said base material protrudes from the middle to the bottom (8) and to one of the sidewalls (7).

6. An optoelectronic component as claimed in claim 5, wherein the said base material protrudes outside the plastic package.

7. An optoelectronic component as claimed in claim 1, wherein the said base material protrudes to the two other sides (6) of the plastic package.

8. An optoelectronic component as claimed in claim 1, wherein the side protrusions can be used for electrical connections.