×

Chip packaging module with active cooling mechanisms

  • US 20050168947A1
  • Filed: 12/11/2003
  • Published: 08/04/2005
  • Est. Priority Date: 12/11/2003
  • Status: Abandoned Application
First Claim
Patent Images

1. In the fabrication of an electrical apparatus modular system in which in each module of said system there is at least one semiconductor chip, each said chip having an essentially parallel;

  • electrical contacting surface, a heat generating region adjacent to said contacting surface and a heat radiating surface;

    said at least one chip being arranged in a surrounding, fluid containing, housing for that module in said system;

    with an external portion of said housing being attached to a heat sink;

    an improvement in transfer of heat that is generated within each said chip to a location that is away from said heat radiating surface of said chip, comprising in combination;

    maintaining a coolant level in said housing that immerses said chips to and including at least each said heat generating region of said chip, and, providing means for moving a coolant fluid in a closed path within said housing serially over each heat radiating surface of each chip and over at least a portion of the interior surface of said housing corresponding to where said heat sink is attached to the outside surface of said housing.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×