Light emitting apparatus
First Claim
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1. A light emitting apparatus, comprising:
- a support;
a wiring layer that is formed on the support; and
an LED element that is flip-chip mounted on the wiring layer formed on the support, wherein the wiring layer comprises;
a conductive layer that is formed on the support and is electrically connected to an electrode of the LED element; and
a reflection layer that is formed on the conductive layer that has a light reflection property to allow a radiated light from the LED element to be reflected thereon, and the reflection layer is of a material that generates no intermetallic compound to a material of the conductive layer.
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Abstract
A light emitting apparatus has: a support; a wiring layer that is formed on the support; and an LED element that is flip-chip mounted on the wiring layer formed on the support. The wiring layer has: a conductive layer that is formed on the support and is electrically connected to an electrode of the LED element; and a reflection layer that is formed on the conductive layer that has a light reflection property to allow a radiated light from the LED element to be reflected thereon. The reflection layer is of a material that generates no intermetallic compound to a material of the conductive layer.
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Citations
12 Claims
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1. A light emitting apparatus, comprising:
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a support;
a wiring layer that is formed on the support; and
an LED element that is flip-chip mounted on the wiring layer formed on the support, wherein the wiring layer comprises;
a conductive layer that is formed on the support and is electrically connected to an electrode of the LED element; and
a reflection layer that is formed on the conductive layer that has a light reflection property to allow a radiated light from the LED element to be reflected thereon, andthe reflection layer is of a material that generates no intermetallic compound to a material of the conductive layer. - View Dependent Claims (2, 3, 4)
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5. A light emitting apparatus, comprising:
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a support;
an LED element that is flip-chip mounted on the support; and
a wiring layer that is formed on the support, wherein the wiring layer comprises;
a conductive layer that is formed on the support and is electrically connected to an electrode of the LED element;
a reflection layer that is formed on the conductive layer that has a light reflection property to allow a radiated light from the LED element to be reflected thereon; and
a barrier metal layer that is formed between the conductive layer and the reflection layer and is of a material that prevents the generation of an intermetallic compound between the conductive layer and the reflection layer. - View Dependent Claims (6, 7, 8)
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9. A light emitting apparatus, comprising:
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a support;
an LED element that is flip-chip mounted on the support; and
a wiring layer that is formed on the support, wherein the wiring layer comprises;
a conductive layer that is formed on the support and is electrically connected to an electrode of the LED element; and
a reflection layer that is formed on the conductive layer that has a light reflection property to allow a radiated light from the LED element to be reflected thereon;
the conductive layer comprises a barrier metal layer that prevents an aggregation in a material of the reflection layer. - View Dependent Claims (10, 11)
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12. A light emitting apparatus, comprising:
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a support;
an LED element that is flip-chip mounted on the support; and
a wiring layer that is formed on the support, wherein the wiring layer comprises;
a conductive layer that is formed on the support and is electrically connected to an electrode of the LED element; and
a reflection layer that is formed on the conductive layer that has a light reflection property to allow a radiated light from the LED element to be reflected thereon;
wherein the reflection layer is partially removed in accordance with the electrode of the LED element to expose a surface of the conductive layer, and the conductive layer is electrically connected through a bump material to the electrode of the LED element at the exposed surface.
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Specification