Mask blank manufacturing method and sputtering target for manufacturing the same
First Claim
1. A method of manufacturing a mask blank having a thin film for forming a mask pattern on a substrate, wherein said thin film is formed by a sputtering method using a sputtering target of which target member and backing plate are bonded to each other with a bonding agent, and further wherein a metal film is formed on a side wall of the sputtering target so as to prevent the bonding agent from being exposed.
1 Assignment
0 Petitions
Accused Products
Abstract
A sputtering target for manufacturing a mask blank having a backing plate 5 where a portion for bonding a target member 4 is protruded like the convex with respect to a base portion 5′, and the target member 4 being formed to have a larger surface area than the area of the bonding portion of the backing plate 5 with extending from the bonding portion over a whole periphery with a bonding agent 30 interposed in-between, and further a metal 40 is deposited to a concave portion formed by a combination of the two structures in such a manner that the elution of the bonding agent 30 can be sealed.
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Citations
27 Claims
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1. A method of manufacturing a mask blank having a thin film for forming a mask pattern on a substrate,
wherein said thin film is formed by a sputtering method using a sputtering target of which target member and backing plate are bonded to each other with a bonding agent, and further wherein a metal film is formed on a side wall of the sputtering target so as to prevent the bonding agent from being exposed.
- 6. The method of manufacturing a mask blank having a thin film for forming a mask pattern on a substrate, wherein said thin film is formed by a sputtering method using a sputtering target which is wholly formed by a target member which is formed by a material to be sputtered.
- 9. The method of manufacturing a mask blank having a thin film for forming a mask pattern on a substrate, wherein said thin film is formed by a sputtering method using a sputtering target of which a target member and a backing plate are bonded to each other with a bonding agent, and further wherein the target member has such a thickness that the bonding agent is not eluted by influence of a heat applied to the bonding agent during the sputtering target being used for forming the thin film.
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12. A sputtering apparatus for manufacturing a mask blank having a thin film to be formed by sputtering deposition for forming a pattern on a substrate, comprising;
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a sputtering chamber, a substrate holding table for holding a substrate which surface to face upward, a sputtering target being opposed to said substrate and having a target member and a backing plate, where said target member and said backing plate bonded to each other with a bonding agent, wherein a metal film is formed on a side wall of the sputtering target so as to prevent the bonding agent from being exposed. - View Dependent Claims (13, 14, 15)
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16. A sputtering apparatus for manufacturing a mask blank having a thin film to be formed by sputtering deposition for forming a pattern on a substrate, comprising;
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a sputtering chamber, a substrate holding table for holding a substrate which surface to be formed face upward, a sputtering target being opposed to said substrate and is wholly formed by a target member which is formed by a material to be sputtered. - View Dependent Claims (17, 18)
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19. A sputtering apparatus for manufacturing a mask blank having a thin film to be formed by sputtering deposition for forming a pattern on a substrate, comprising;
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a sputtering chamber, a substrate holding table for holding a substrate which surface to be formed face upward, a sputtering target being opposed to said substrate and having a target member formed by a material to be sputtered and a backing plate, where said target member and said backing plate bonded to each other with a bonding agent, wherein a metal film is formed on a side wall of the sputtering target so as to prevent the bonding agent from being exposed. - View Dependent Claims (20, 21)
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22. A sputtering target for manufacturing a mask blank which is used for manufacturing a mask blank having a thin film to form a pattern on a substrate, comprising:
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the backing plate which has a base portion and a bonding portion, said bonding portion being convexly protruded from the base portion in order to bond the target member on a top surface thereof, the target member which has surface area being larger than an area of the bonding portion of the backing plate, and said target member is bonded to said bonding portion so that the target member has a flange portion extending from a whole periphery of the bonding portion of the backing plate, and the metal film which is formed on a side wall of the sputtering target so as to prevent the bonding agent from being exposed. - View Dependent Claims (23)
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24. A sputtering target for manufacturing a mask blank which is used for manufacturing a mask blank having a thin film to form a pattern on a substrate,
wherein said sputtering target for forming the thin film is wholly formed by a target member which is formed by a material to be sputtered.
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26. A sputtering target for manufacturing a mask blank which is used for manufacturing a mask blank having a thin film to form a pattern on a substrate, comprising a target member for forming the thin film, a backing plate, and a bonding agent by which the target member and backing plate are bonded to each other, wherein
the target member has such a thickness that the bonding agent is not eluted by an influence of a heat applied to the bonding agent during the sputtering target being used for forming the thin film.
Specification