Method and apparatus for monitoring tool performance

• US 20050171627A1
• Filed: 11/15/2004
• Published: 08/04/2005
• Est. Priority Date: 05/29/2002
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Tozawa, Masaki, Funk, Merritt
• Granted Patent: US 7,113,838 B2
• Time in Patent Office: Days
• US Class Current: 700/121
• CPC Class Codes: G05B 19/4065 Monitoring tool breakage, life or condition
• CPC Class Codes: G05B 2219/37234 Monitor tool before, after and during machining
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/67276 Production flow monitoring, e.g. for increasing throughput program-control systems per se G05B19/00, e.g. total factory control G05B19/418

Abstract

A method and system for monitoring tool performance for processing tools in a semiconductor processing system. The semiconductor processing system includes a number of processing tools, a number of processing modules, a number of sensors, and an alarm management system. A tool health control strategy is executed in which tool health data for the processing tool is collected. A tool health analysis strategy is executed in which the tool health data is analyzed. An intervention manager can pause the processing tool when an alarm has occurred. The intervention manager refrains from pausing the processing tool when an alarm has not occurred.

Claims

1. A method of monitoring a processing tool in a semiconductor processing system, the method comprising:

putting the processing tool into a first state;

executing a tool health control strategy;

collecting tool health data for the processing tool;

executing a tool health analysis strategy;

analyzing the tool health data;

pausing the processing tool when an alarm has occurred; and

refraining from pausing the processing tool when an alarm has not occurred.

2. The method as claimed in claim 1, wherein the putting of the processing tool into a first state comprises moving a wafer into the processing tool.

3. The method as claimed in claim 2, wherein the wafer comprises at least one of a product wafer, a dummy wafer, a diagnostic wafer, and a test wafer.

4. The method as claimed in claim 1, wherein the putting of the processing tool into a first state comprises moving a wafer into a process module.

5. The method as claimed in claim 4, wherein the wafer comprises at least one of a product wafer, a dummy wafer, a diagnostic wafer, and a test wafer.

6. The method as claimed in claim 1, wherein the putting of the processing tool into a first state comprises starting a process recipe.

7. The method as claimed in claim 1, wherein the executing of a tool health control strategy comprises:

determining a context; and

context-matching the context with a control strategy.

8. The method as claimed in claim 7, wherein the context comprises a wafer ID, a tool ID, a recipe ID, a lot ID, and a material ID.

9. The method as claimed in claim 8, wherein the context further comprises a cassette ID, process module ID, a slot ID, a recipe start time, a recipe stop time, a maintenance counter value, and a product ID.

10. The method as claimed in claim 1, wherein the collecting of tool health data for the processing tool comprises:

executing a data collection plan associated with the tool health control strategy; and

executing a data pre-processing plan associated with the tool health control strategy.

11. The method as claimed in claim 10, wherein the collecting of tool health data for the processing tool further comprises executing a start-event judgment plan associated with the tool health control strategy.

12. The method as claimed in claim 11, wherein the executing of a start-event judgment plan comprises using a wafer-in event.

13. The method as claimed in claim 11, wherein the executing of a start-event judgment plan comprises:

executing a set of SQL rules; and

sending an alarm message to an intervention plan.

14. The method as claimed in claim 1, wherein the executing of a tool health control strategy comprises creating the tool health control strategy using a strategy configuration screen.

15. The method as claimed in claim 1, wherein the collecting of tool health data comprises creating a tool health data collection plan using a data collection plan configuration screen.

16. The method as claimed in claim 1, wherein the analyzing of the tool health data comprises creating a tool health analysis plan using a plan editor screen.

17. The method as claimed in claim 1, wherein the executing of a tool health analysis strategy comprises:

determining a context; and

context-matching the context with at least one tool health analysis strategy.

18. The method as claimed in claim 17, wherein the context comprises a wafer ID, a tool ID, a recipe ID, a lot ID, and a material ID.

19. The method as claimed in claim 18, wherein the context further comprises a cassette ID, a process module ID, a slot ID, a recipe start time, a recipe stop time, a maintenance counter value, and a product ID.

20. The method as claimed in claim 1, wherein the analyzing of tool health data for the processing tool comprises:

executing at least one tool health analysis plan; and

executing at least one end-event judgment plan associated with the tool health analysis strategy.

21. The method as claimed in claim 20, wherein the executing of at least one end-event judgment plan comprises:

executing a set of SQL rules; and

sending an alarm message to an intervention plan.

22. The method as claimed in claim 1, wherein the pausing of the processing tool when an alarm has occurred comprises executing an intervention plan.

23. The method as claimed in claim 22, wherein the executing of an intervention plan comprises:

receiving an alarm message from at least one end-event judgment plan;

processing the alarm message to determine the severity level; and

pausing the processing tool when the severity level is above a threshold value.

24. The method as claimed in claim 22, wherein the executing of an intervention plan comprises:

receiving an alarm message from at least one start-event judgment plan;

processing the alarm message to determine the severity level; and

pausing the processing tool when the severity level is above a threshold value.

25. A tool status monitoring system for monitoring a processing tool in a semiconductor processing system, the tool status monitoring system comprising:

a plurality of sensors coupled to the processing tool;

means for executing a tool health control strategy including means for executing a data collection plan for collecting tool health data, and means for executing a data pre-processing plan for pre-processing the collected tool health data, the data collection plan comprising a sensor plan for controlling the data collected by the plurality of sensors;

means for executing a tool health analysis strategy including means for executing a analysis plan for analyzing the tool health data and means for executing a judgment plan for determining if an alarm has occurred; and

an intervention manager for pausing the processing tool when an alarm has occurred and refraining from pausing the processing tool when an alarm has not occurred.

26. The tool status monitoring system as claimed in claim 25, further comprising means for putting the processing tool into a first state when a wafer moves into the processing tool.

27. The method as claimed in claim 26, wherein the wafer comprises at least one of a product wafer, a dummy wafer, a diagnostic wafer, and a test wafer.

28. The tool status monitoring system as claimed in claim 25, wherein the means for executing a tool health control strategy comprises:

means for determining a context; and

means for context-matching the context with the tool health control strategy.

29. The tool status monitoring system as claimed in claim 25, further comprising means for executing a start-event judgment plan associated with the tool health control strategy.

30. The tool status monitoring system as claimed in claim 25, wherein the means for executing a tool health analysis strategy further comprises:

means for determining a context; and

means for context-matching the context with the tool health analysis strategy.

31. The tool status monitoring system as claimed in claim 25, wherein the means for executing a tool health control strategy comprises:

at least one Strategy Configuration GUI screen for configuring the tool health control strategy; and

at least one GUI screen for viewing tool health status.

32. The tool status monitoring system as claimed in claim 31, wherein the at least one Strategy Configuration GUI screen comprises a Title Panel, Information Panel, and Control Panel.

33. The tool status monitoring system as claimed in claim 25, wherein the means for executing a tool health control strategy comprises at least one screen from a group consisting of an English language screen, a Japanese language screen, a Taiwanese language screen, a Chinese language screen, a Korean language screen, a German language screen, and a French language screen.

34. The tool status monitoring system as claimed in claim 25, wherein the means for executing a tool health control strategy comprises a GUI screen for data collection plan configuration, and a GUI screen for preprocessing plan configuration.

35. The tool status monitoring system as claimed in claim 25, wherein the means for executing a tool health analysis strategy comprises at least one screen from a group consisting of an English language screen, a Japanese language screen, a Taiwanese language screen, a Chinese language screen, a Korean language screen, a German language screen, and a French language screen.

36. The tool status monitoring system as claimed in claim 25, wherein the intervention manager comprises weighting factors for inputs from start-event judgment plans and weighting factors for inputs from end-event judgment plans.

37. The tool status monitoring system as claimed in claim 25, wherein the analysis plan at least one of a Principal Component Analysis (PCA) plan, a Partial Least Squares (PLS) plan, a Statistical Process Control (SPC) plan, a Multivariate Analysis (MVA) plan, and a User Defined plan.