Isolated planar mesogyroscope
First Claim
1. A method of fabricating a mesoscaled resonator for an inertial sensor, comprising:
- etching a baseplate;
bonding a substantially thermally non-conductive wafer to the etched baseplate; and
through-etching the substantially thermally non-conductive wafer to form a mesoscaled resonator with capacitive electrodes.
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Accused Products
Abstract
An inertial sensor includes a mesoscaled disc resonator comprised of micro-machined substantially thermally non-conductive wafer with low coefficient of thermal expansion for sensing substantially in-plane vibration, a rigid support coupled to the resonator at a central mounting point of the resonator, at least one excitation electrode within an interior of the resonator to excite internal in-plane vibration of the resonator, and at least one sensing electrode within the interior of the resonator for sensing the internal in-plane vibration of the resonator. The inertial sensor is fabricated by etching a baseplate, bonding the substantially thermally non-conductive wafer to the etched baseplate, through-etching the wafer using deep reactive ion etching to form the resonator, depositing a thin conductive film on the through-etched wafer. The substantially thermally non-conductive wafer may comprise a silicon dioxide glass wafer, which is a silica glass wafer or a borosilicate glass wafer, or a silicon-germanium wafer.
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Citations
27 Claims
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1. A method of fabricating a mesoscaled resonator for an inertial sensor, comprising:
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etching a baseplate;
bonding a substantially thermally non-conductive wafer to the etched baseplate; and
through-etching the substantially thermally non-conductive wafer to form a mesoscaled resonator with capacitive electrodes. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An inertial sensor, comprising:
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a mesoscaled disc resonator comprised of a micromachined substantially thermally non-conductive material for sensing substantially in-plane vibration;
a rigid support coupled to the resonator at a central mounting point of the resonator;
at least one excitation electrode within an interior of the resonator to excite internal in-plane vibration of the resonator; and
at least one sensing electrode within the interior of the resonator for sensing the internal in-plane vibration of the resonator. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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Specification