Multiple output inertial sensing device

• US 20050172715A1
• Filed: 04/13/2005
• Published: 08/11/2005
• Est. Priority Date: 07/31/2001
• Status: Active Grant

• Current Assignee: Michael L. Babala
• Original Assignee: Michael L. Babala
• Inventors: Babala, Michael L.
• Granted Patent: US 7,040,166 B2
• Time in Patent Office: Days
• US Class Current: 73/504.160
• CPC Class Codes: B60R 2021/01325 Vertical acceleration
• CPC Class Codes: B60R 2021/01327 Angular velocity or angular acceleration
• CPC Class Codes: B60R 21/0132 responsive to vehicle motion parameters , e.g. to vehicle longitudinal or transversal deceleration or speed value
• CPC Class Codes: G01C 21/166 Mechanical, construction or arrangement details of inertial navigation systems
• CPC Class Codes: G01P 15/08 with conversion into electric or magnetic values

Abstract

An inertial sensor includes a single linear accelerometer disposed upon a silicon wafer. The accelerometer is electrically connected to a plurality of signal conditioning circuits that generate an output signals in different ranges. Each signal conditioning circuit has an output that is electrically connected to an associated control device.

Claims

1. An inertial sensor adapted to be attached to a body comprising:

a base member, said base member being formed from a silicon wafer;

a single linear acceleration sensor element disposed on said base member, said linear sensor element operable to sense a change in linear acceleration of said body; and

a plurality of signal conditioning circuits connected to said linear sensor element, with a first one of said signal conditioning circuits being calibrated to sense a first range of change in said linear acceleration of said body and a second one of said signal conditioning circuits being calibrated to sense a second range of change in said same linear acceleration of said body, said second range of change in said linear acceleration of said body being different from said first range of change in said linear acceleration of said body, said signal conditioning circuits adapted to be connected to at least one control system, said signal conditioning circuits operable to generate a plurality of electrical output signals with each electrical output signal being a function of said change in said linear acceleration while also being within the calibration range associated with said signal conditioning circuit.

2. The inertial sensor according to claim 1 wherein said signal conditioning circuits are located remotely from said silicon wafer and said linear acceleration sensor.

3. The inertial sensor according to claim 2 including a multiplexer for combining signals and a demultiplexer for separating signals, said multiplexer communicating with said demultiplexer, said multiplexer connected to said signal conditioning circuits and operable to combine the output signals generated by said plurality of signal conditioning circuits into a single output signal that is transmitted to said demultiplexer, said demultiplexer operative to separate said transmitted signal into the individual output signals generated by said signal conditioning circuits.

4. The inertial sensor according to claim 3 wherein said signal conditioning circuits are included within an Application Specific Integrated Circuit.

5. The inertial sensor according to claim 2 wherein said signal conditioning circuits are included within an Application Specific Integrated Circuit.

6. The inertial sensor according to claim 1 wherein said signal conditioning circuits are integral with said silicon wafer and said linear acceleration sensor.

7. The inertial sensor according to claim 6 including a multiplexer for combining signals and a demultiplexer for separating signals, said multiplexer communicating with said demultiplexer, said multiplexer connected to said signal conditioning circuits and operable to combine the output signals generated by said plurality of signal conditioning circuits into a single output signal that is transmitted to said demultiplexer, said demultiplexer operative to separate said transmitted signal into the individual output signals generated by said signal conditioning circuits.

8. The inertial sensor according to claim 7 wherein said signal conditioning circuits are included within an Application Specific Integrated Circuit.

9. The inertial sensor according to claim 6 wherein said signal conditioning circuits are included within an Application Specific Integrated Circuit.

10. The inertial sensor according claim 1 including a multiplexer for combining signals and a demultiplexer for separating signals, said multiplexer communicating with said demultiplexer, said multiplexer connected to said signal conditioning circuits and operable to combine the output signals generated by said plurality of signal conditioning circuits into a single output signal that is transmitted to said demultiplexer, said demultiplexer operative to separate said transmitted signal into the individual output signals generated by said signal conditioning circuits.

11. The inertial sensor according to claim 10 wherein said signal conditioning circuits are located remotely from said silicon wafer and said linear acceleration sensor.

12. The inertial sensor according to claim 11 wherein said signal conditioning circuits are included within an Application Specific Integrated Circuit.

13. The inertial sensor according to claim 10 wherein said signal conditioning circuits are integral with said silicon wafer and said linear acceleration sensor.

14. The inertial sensor according to claim 13 wherein said signal conditioning circuits are included within an Application Specific Integrated Circuit.