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Interlayer adhesion promoter for low k materials

  • US 20050173803A1
  • Filed: 09/20/2002
  • Published: 08/11/2005
  • Est. Priority Date: 09/20/2002
  • Status: Abandoned Application
First Claim
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1. A multilayered dielectric structure which comprises:

  • a) a porous dielectric layer which has a porosity of about 10% or more;

    b) an adhesion promoting dielectric layer on the porous dielectric layer which has a porosity of about 10% or less; and

    c) a substantially nonporous capping layer on the adhesion promoting dielectric layer.

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