Device and method for encapsulation and mounting of RFID

• US 20050174241A1
• Filed: 10/25/2004
• Published: 08/11/2005
• Est. Priority Date: 01/30/2004
• Status: Active Grant

• Current Assignee: United Parcel Service Of America Incorporated (United Parcel Service Incorporated)
• Original Assignee: United Parcel Service Of America Incorporated (United Parcel Service Incorporated)
• Inventors: Olsen, John
• Granted Patent: US 7,405,656 B2
• Time in Patent Office: Days
• US Class Current: 340/572.800
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0776 the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/2434 Tag housing and attachment details
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

This invention involves encapsulating an RFID device in an encapsulating material by known encapsulating processes to form a domed, encapsulated RFID tag. The encapsulating material may be translucent or opaque, flexible or hard, and has minimal effect on transmission or reception of radio frequency (RF) signals. The invention further involves a stand-off bracket, composed of one or more materials that have minimal effect on transmission or reception of RF signals, for mounting an RFID device on or near materials that impede RF transmission and reception. The encapsulated RFID tag and stand-off bracket, separately, may have an adhesive or other attachment means on one of their surfaces so that they may be adhered or otherwise attached to another surface. In one application, an encapsulated RFID tag in the 860-928 MHz range is mounted on a stand-off bracket and may be used for tracking items to which it is attached.

Claims

1. An encapsulated radio frequency identification (“

RFID”

) tag comprising;

an RFID device; and

an encapsulating material.

2. The encapsulated RFID tag of claim 1, further comprising an art image layer.

3. The encapsulated RFID tag of claim 2, wherein the art image layer is comprised of polyester.

4. The encapsulated RFID tag of claim 1, further comprising an adhesive layer for adhering the encapsulated RFID tag to a surface.

5. The encapsulated RFID tag of claim 1, wherein the encapsulating material is selected from the group consisting of polyurethane, polyethylene, polypropylene, polystyrene, polyester, and epoxy, and combinations thereof.

6. The encapsulated RFID tag of claim 1, wherein the encapsulating material is translucent.

7. The encapsulated RFID tag of claim 1, wherein the encapsulating material is opaque.

8. The encapsulated RFID tag of claim 1, further comprising a substrate layer, wherein the RFID device is placed on the substrate layer and the encapsulating material is placed on the RFID device.

9. The encapsulated RFID tag of claim 1, wherein the encapsulating material is domed.

10. The encapsulated RFID tag of claim 1, wherein the encapsulated RFID tag is used for the tracking of items to which it is attached.

11. The encapsulated RFID tag of claim 1, wherein the encapsulated RFID device is used for one or more of a label, nametag, luggage tag, advertisement, key fob, emblem, automobile emblem, and decoration.

12. A domed, encapsulated RFID tag comprising:

an adhesive layer;

an RFID device;

an art image layer; and

an encapsulating material.

13. The domed, encapsulated RFID tag of claim 12, wherein the adhesive layer is comprised of a 2-mil acrylic adhesive layer.

14. The domed, encapsulated RFID tag of claim 12, wherein the RFID device is comprised of an RFID transponder.

15. The domed, encapsulated RFID tag of claim 12, wherein the art image layer is comprised of a 2.4-mil polyester image substrate.

16. The domed, encapsulated RFID tag of claim 12, wherein the encapsulating material is translucent.

17. A domed, encapsulated RFID tag comprising:

a 2-mil acrylic adhesive layer;

an RFID device comprised of an RFID transponder;

a 2.4-mil polyester art image layer; and

an encapsulating material, wherein said encapsulating material is translucent.

18. A method of encapsulating an RFID device comprising:

substantially encapsulating the RFID device in an encapsulating material; and

curing said encapsulating material.

19. The method of claim 18, wherein substantially encapsulating the RFID device comprises using an encapsulating material selected from the group consisting of polyurethane, polyethylene, polypropylene, polystyrene, polyester, an epoxy, and combinations thereof.

20. The method of claim 18, wherein substantially encapsulating the RFID device comprises using a translucent encapsulating material.

21. The method of claim 18, wherein substantially encapsulating the RFID device comprises using an opaque encapsulating material.

22. A method of encapsulating and overlaying an RFID device comprising:

overlaying the RFID device with an art image;

substantially encapsulating the RFID device and the art image in an encapsulating material; and

curing said encapsulating material.

23. The method of claim 22, wherein overlaying the RFID device with the art image comprises using an art image layer comprised of a 2.4-mil polyester substrate image.

24. The method of claim 22, wherein encapsulating the RFID device and art image comprises using a translucent encapsulating material.

25. The method of claim 22, wherein encapsulating the RFID device and art image comprises using an opaque encapsulating material.

26. A method of fabricating an encapsulated RFID tag comprising:

overlaying an art image over at least one surface of an RFID device;

placing a viscous encapsulating material on at least one surface of the RFID device and art image; and

curing the encapsulating material to a non-viscous state.

27. A method of fabricating an encapsulated RFID tag comprising:

overlaying an art image over at least one surface of an RFID device;

placing the RFID device and art image on a base substrate;

placing a viscous encapsulating material on at least one surface of the RFID device and art image; and

curing the encapsulating material to a non-viscous state.

28. An RFID assembly comprising:

a stand-off bracket for mounting an RFID device in the 860-928 MHz range, wherein the stand-off bracket further comprises;

a first surface for mounting said stand-off bracket on a mounting or support surface;

a second surface for mounting the RFID device, wherein said first and second surfaces are separated by a certain distance; and

a 860-928 MHz range RFID device mounted on said stand-off bracket.

29. The RFID assembly of claim 28, wherein the certain distance between said first and second surfaces comprises a hollow space.

30. The RFID assembly of claim 28, wherein the certain distance between said first and second surfaces comprises a filled space.

31. The RFID assembly of claim 30, wherein said filled space is filled with one or more materials that are RF permeable.

32. The RFID assembly of claim 30, wherein said filled space is filled with the same material that comprises the stand-off bracket.

33. The RFID assembly of claim 28, wherein said first surface is attached to a mounting or support surface by gluing, nailing, screwing, stapling, clamping, or any combination thereof.

34. The RFID assembly of claim 28, wherein said stand-off bracket is comprised of a material chosen from the group consisting of injection molded plastic, corrugated plastic, paper (cardboard), and any combination thereof.

35. The RFID assembly of claim 28, wherein the stand-off bracket may be rectangular, circular, oval, triangular, spherical, hemispherical, or any other shape.

36. The RFID assembly of claim 28, wherein said RFID assembly is mounted within a mirror assembly of a vehicle.

37. An RFID assembly comprising:

a stand-off bracket for mounting an encapsulated RFID device, wherein the stand-off bracket further comprises;

a first surface for mounting said stand-off bracket on a mounting or support surface;

a second surface for mounting the encapsulated RFID device, wherein said first and second surfaces are separated by a certain distance; and

a 860-928 MHz range encapsulated RFID device mounted on said stand-off bracket.

38. The RFID assembly of claim 37, wherein the certain distance between said first and second surfaces comprises a hollow space.

39. The RFID assembly of claim 37, wherein the certain distance between said first and second surfaces comprises a filled space.

40. The RFID assembly of claim 39, wherein said filled space is filled with one or more materials that are RF permeable.

41. The RFID assembly of claim 39, wherein said filled space is filled with the same material that comprises the stand-off bracket.

42. The RFID assembly of claim 37, wherein said first surface is attached to a mounting or support surface by gluing, nailing, screwing, stapling, clamping, or any combination thereof.

43. The RFID assembly of claim 37, wherein said stand-off bracket is comprised of a material chosen from the group consisting of injection molded plastic, corrugated plastic, paper (cardboard), and any combination thereof.

44. The RFID assembly of claim 37, wherein the stand-off bracket may be rectangular, circular, oval, triangular, spherical, hemispherical, or any other shape.

45. The RFID assembly of claim 37, wherein said RFID assembly is mounted in a mirror assembly of a vehicle.

46. An RFID assembly comprising:

a stand-off bracket for mounting a domed, encapsulated RFID device, wherein the stand-off bracket further comprises;

a first surface for mounting said stand-off bracket on a mounting or support surface;

a second surface for mounting the RFID device, wherein said first and second surfaces are separated by a certain distance; and

a 860-928 MHz range domed, encapsulated RFID device mounted on said stand-off bracket.

47. The RFID assembly of claim 46, wherein the certain distance between said first and second surfaces comprises a hollow space.

48. The RFID assembly of claim 46, wherein the certain distance between said first and second surfaces comprises a filled space.

49. The RFID assembly of claim 48, wherein said filled space is filled with one or more materials that are RF permeable.

50. The RFID assembly of claim 48, wherein said filled space is filled with the same material that comprises the stand-off bracket.

51. The RFID assembly of claim 46, wherein said first surface is attached to a mounting or support surface by gluing, nailing, screwing, stapling, clamping, or any combination thereof.

52. The RFID assembly of claim 46, wherein said stand-off bracket is comprised of a material chosen from the group consisting of injection molded plastic, corrugated plastic, paper (cardboard), and any combination thereof.

53. The stand-off bracket of claim 46, wherein the stand-off bracket may be rectangular, circular, oval, triangular, spherical, hemispherical, or any other shape.

54. The RFID assembly of claim 46, wherein said RFID assembly is mounted within a mirror assembly of a vehicle.

55. An RFID assembly comprising:

a domed, encapsulated RFID tag comprised of;

a 2-mil acrylic adhesive layer;

an RFID device comprising an RFID transponder;

a 2.4-mil polyester art image layer; and

an encapsulating material, wherein said encapsulating material is translucent;

a stand-off bracket comprised of;

a first surface for mounting said stand-off bracket on a mounting or support surface;

a second surface for mounting the RFID device, wherein said space between said first and second surfaces is hollow;

wherein said domed, encapsulated RFID tag is mounted on said stand-off bracket within a mirror assembly of a vehicle.