Method of producing printed circuit board with embedded resistor

• US 20050175385A1
• Filed: 02/03/2004
• Published: 08/11/2005
• Est. Priority Date: 11/05/2003
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Ahn, Jin-Yong, Lee, Seok-Kyu, Hong, Jong-Kuk, Kang, Jang-Kyu, Sun, Byung-Kook, Cho, Suk-Hyun
• Granted Patent: US 7,284,317 B2
• Time in Patent Office: Days
• US Class Current: 400/209
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: B23K 26/351 for trimming or tuning of electrical components
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2201/0347 Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias reinforcing the conductive pattern H05K3/24
• CPC Class Codes: H05K 2203/1461 Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
• CPC Class Codes: H05K 3/064 Photoresists
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: Y10T 29/49082 Resistor making
• CPC Class Codes: Y10T 29/49098 Applying terminal
• CPC Class Codes: Y10T 29/49101 Applying terminal
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49151 by deforming or shaping
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths

Abstract

Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.

Claims

1. A method of producing a printed circuit board with an embedded resistor, comprising:

removing a portion of a copper clad of a copper clad laminate, corresponding to a space to receive the resistor;

filling a resistor paste in the space; and

forming a circuit pattern on the copper clad laminate in which the resistor paste is filled.

2. The method as set forth in claim 1, wherein the filling of the resistor paste comprises:

drying the resistor paste filled in the copper clad; and

grinding the dried resistor paste so that the resistor paste has a same thickness as the copper clad around the resistor paste.

3. The method as set forth in claim 1, wherein the filling of the resistor paste is conducted using a vacuum printing device.

4. The method as set forth in claim 1, further comprising forming a silver, gold, nickel, or platinum layer on an inner copper wall of the space to receive the resistor, prior to the filling of the resistor paste.

5. The method as set forth in claim 1, further comprising plating silver, gold, nickel, or platinum on contact portions of the filled resistor, prior to the forming of the circuit pattern.

6. A method of producing a printed circuit board with an embedded resistor, comprising:

removing a portion of a copper clad of a copper clad laminate, corresponding to a space to receive the resistor;

filling a resistor paste in the space;

plating a metal layer on the copper clad laminate including the resistor paste filled therein; and

forming a circuit pattern on the resulting copper clad laminate.

7. The method as set forth in claim 6, wherein the filling of the resistor paste comprises:

drying the resistor paste filled in the copper clad; and

grinding the dried resistor paste so that the resistor paste has a same thickness as the copper clad around the resistor paste.

8. The method as set forth in claim 6, wherein the filling of the resistor paste is conducted using a vacuum printing device.

9. The method as set forth in claim 6, further comprising plating silver, gold, nickel, or platinum on an inner copper wall of the space to receive the resistor, prior to the filling of the resistor paste.

10. The method as set forth in claim 6, further comprising providing a material with excellent electric conductivity on contact portions of the resistor paste, after the filling of the resistor paste.

11. A method of producing a printed circuit board with an embedded resistor, comprising:

forming a plating resist pattern on a portion of a copper clad laminate corresponding to a first space to receive a portion of the resistor;

plating the copper clad laminate on which the plating resist pattern is formed, to form a plated layer on a copper clad;

forming an etching resist pattern on the plated copper clad laminate to etch the portion of the copper clad corresponding to the first space to receive the portion of the resistor;

removing the plating resist pattern;

etching the copper clad laminate from which the plating resist pattern is removed;

filling a resistor paste in a second space to receive the whole resistor; and

forming a circuit pattern on the resulting copper clad laminate.

12. The method as set forth in claim 11, wherein the filling of the resistor paste comprises:

drying the resistor paste filled in the copper clad laminate; and

grinding the dried resistor paste so that the resistor paste has a same thickness as the copper clad around the resistor paste.

13. The method as set forth in claim 11, wherein the filling of the resistor paste is conducted using a vacuum printing device.

14. The method as set forth in claim 11, further comprising plating silver, gold, nickel, or platinum on an inner copper wall of the space to receive the resistor, prior to the filling of the resistor paste.

15. The method as set forth in claim 11, further comprising plating silver, gold, nickel, or platinum on contact portions of the filled resistor, prior to the forming of the circuit pattern.

16. The method as set forth in claim 12, further comprising plating a metal material on the copper clad laminate in which the resistor paste is filled.