Apparatus and method for treating disc-shaped substrates
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Abstract
In order to carry out simple, low-cost, uniform treatment of substrates, a device is provided for the processing of disk-shaped substrates, especially semiconductor wafers, comprising a substantially flat carrier ring, which can be rotated on a plane about an axis of rotation by means of a rotation device, and at least three support elements extending from the plane of the carrier ring, forming a multi-point support for the support at a distance from the plane of the carrier ring. The invention also relates to a device and a method for the treatment of disk-shaped substrates, especially semiconductor wafers, wherein the substrates are rotated about an axis of rotation which is disposed in a substantially vertical position with respect to the plane of the substrates and whereby at least one first group of nozzles are disposed at various distances from the axis of rotation, enabling a first fluid to be applied, said nozzles being controlled either individually or in sub-groups, in order to carry out selective treatment of surface areas of the substrate.
15 Citations
86 Claims
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1-43. -43. (canceled)
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44. An apparatus for treating disc-shaped substrates, comprising:
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a device 10 for rotating said substrates 3 about an axis of rotation A; and
at least one first group of nozzles, 40, 60, 80, wherein the nozzles of said first group are differently spaced relative to said axis of rotation A, and wherein said nozzles are adapted to be controlled individually or in sub groups. - View Dependent Claims (45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61)
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62. A method of treating disc-shaped substrates, including the steps of:
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rotating said substrates 3 about an axis of rotation A that is disposed essentially perpendicular to a plane of said substrates;
providing at least one first group of nozzles 40, 60, 80, the nozzles of which are differently spaced relative to said axis of rotation A;
applying a first fluid to said substrates via said at least one first group of nozzles; and
controlling said nozzles of said first group individually or in sub groups to achieve a selective treatment of surface regions of a substrate 3. - View Dependent Claims (63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73)
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74. An apparatus for treating disc-shaped substrates, comprising:
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an essentially planar carrier ring;
a rotation device for rotating said carrier ring in the plane thereof about an axis of rotation; and
at least three support elements, which extend out of said plane of said carrier ring, wherein said support elements form a multi-point support for a substrate at a distance from said plane of said carrier ring. - View Dependent Claims (75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86)
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Specification