Thermal infrared sensor device and thermal infrared sensor array

• US 20050178967A1
• Filed: 05/28/2004
• Published: 08/18/2005
• Est. Priority Date: 02/17/2004
• Status: Active Grant

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Inoue, Hiromoto, Fujii, Yoshio, Nakaki, Yoshiyuki, Hata, Hisatoshi
• Granted Patent: US 7,145,144 B2
• Time in Patent Office: Days
• US Class Current: 250/339.40
• CPC Class Codes: G01J 5/02 Constructional details
• CPC Class Codes: G01J 5/023 Particular leg structure or construction or shape; Nanotubes
• CPC Class Codes: G01J 5/024 Special manufacturing steps or sacrificial layers or layer structures
• CPC Class Codes: G01J 5/08 Optical arrangements
• CPC Class Codes: G01J 5/0808 Convex mirrors
• CPC Class Codes: G01J 5/0853 having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid
• CPC Class Codes: G01J 5/20 using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices

Abstract

A thermal infrared sensor device includes a substrate having a concave portion, a temperature detecting portion connected to the substrate via a supporting leg held at an upper portion of a space within the concave portion, an infrared reflecting film covering at least a portion of the supporting leg without being thermally connected to the temperature detecting portion, and an absorbing hood portion held opposite the infrared reflecting film and thermally connected to the temperature detecting portion, without being thermally connected to the infrared reflecting film, and extending laterally, in a plate shape, covering at least a portion of the infrared reflecting film.

Claims

1. A thermal infrared sensor device, comprising:

a substrate having a concave portion;

a temperature detecting portion connected to said substrate via a supporting leg and held within said concave portion;

an infrared reflecting film covering at least a portion of said supporting leg without being thermally connected to said temperature detecting portion; and

an absorbing hood portion, above said infrared reflecting film relative to said substrate, thermally connected to said temperature detecting portion but not thermally connected to said infrared reflecting film, and extending laterally in a plate shape, covering at least a portion of said infrared reflecting film.

2. The thermal infrared sensor device according to claim 1, comprising:

an interconnection disposed opposite and spaced from a portion of said substrate, but not opposite said concave portion;

an interconnection protecting insulating film directly covering said interconnection; and

a support, shaped as a flat plate, directly on an upper side of said interconnection protecting insulating film and extending laterally, wherein said infrared reflecting film is in contact with an upper side of said support.

3. The thermal infrared sensor device according to claim 2, wherein

said infrared reflecting film is disposed on said support but not opposite said interconnection protecting insulating film.

4. The thermal infrared sensor device according to claim 1, wherein

said absorbing hood portion is thermally connected to said temperature detecting portion via a vertically extending tubular pillar in contact with an upper side of said temperature detecting portion, and

an etching hole in a region including a side face of said pillar establishes communication between an internal space of said concave portion and a space opposite said absorbing hood portion.

5. The thermal infrared sensor device according to claim 4, wherein said etching hole is disposed substantially at a center of said concave portion when seen from directly opposite said concave portion.

6. A thermal infrared sensor array comprising a plurality of the thermal infrared sensor devices according to claim 1, wherein said plurality of thermal infrared sensor devices are arranged in an array.