Semiconductor device
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Accused Products
Abstract
A substrate (10) has at least one recess (20) and/or protrusion (21) formed on the surface thereof so as to scatter or diffract the light generated in an active layer (12). The recess and/or protrusion is formed in such a shape that can reduce crystalline defect in semiconductor layers (11, 13).
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Citations
47 Claims
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1-27. -27. (canceled)
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28. A semiconductor device comprising:
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a substrate having recesses and/or protrusions formed on the surface thereof, and semiconductor layers made of material different from that of said substrate and formed on the surface of said substrate, wherein a side face of said recesses and/or protrusions includes at least two surfaces having different inclination angles. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
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39. A light emitting device having semiconductor light emitting element on a substrate that has protrusions separated from each other and disposed periodically, wherein width of cross section of said protrusion is larger on the bottom side than on the top face side, and inclination angle of the side face of said protrusion is smaller on the top face side than on the bottom side;
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wherein, with a circle that is in plane with the substrate surface and circumscribed with the side faces of two closest protrusions being referred to as a first circle, a circle that is in plane with the substrate surface and circumscribed with the side faces of at least three protrusions being referred to as a second circle and a circle that is in plane with the top surface of said protrusions and circumscribed with the side faces of two closest protrusions being referred to as a third circle, the diameter of said second circle is larger than the diameter of said first circle and smaller than the diameter of said third circle. - View Dependent Claims (40, 41, 42)
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43. A method of manufacturing a substrate for a light emitting device that has a plurality of protrusions and/or recesses, comprising:
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a first step of etching a part of the substrate with a protective film provided on the substrate and forming protrusions and/or recesses having side faces; and
a second step of exposing and etching the side face of said protrusions and/or recesses, at least a part of the top faces of said protrusions and/or at least a part of the top surface of the substrate between said recesses, so as to make the inclination angle of the side face of said recesses and/or protrusions on an lower side larger than the inclination angle on an upper side. - View Dependent Claims (44, 45, 46, 47)
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Specification