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Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

  • US 20050179982A1
  • Filed: 04/07/2005
  • Published: 08/18/2005
  • Est. Priority Date: 12/07/2000
  • Status: Abandoned Application
First Claim
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1. A spatial light modulator comprising;

  • a lower silicon substrate comprising a plurality of circuitry, electrodes and deflectable mirrors;

    a glass substrate bonded in spaced apart relationship to the lower substrate;

    an intermediate substrate disposed between the upper and lower substrates and having an open area for defining a cavity between the silicon substrate and the glass substrate, with the deflectable mirrors within the gap;

    a light blocking material on a lower side of the glass substrate and provided as a rectangular light blocking mask;

    wherein the mirrors comprise substantially square mirror plates and hinges that allow the mirror plates to move relative to the upper and lower substrates;

    wherein tbe mirrors are formed on the lower silicon substrate in a rectangular array area, and wherein the mirrors have a plurality of mirror edges that are neither parallel nor perpendicular to edges of the rectangular array area;

    a RAM cell at each mirror location.

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