DIELECTRIC MULTILAYER FILTER AND ITS MANUFACTURING METHOD, AND SOLID-STATE IMAGING DEVICE

• US 20050180010A1
• Filed: 02/16/2005
• Published: 08/18/2005
• Est. Priority Date: 02/17/2004
• Status: Abandoned Application

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: MUKAIYAMA, Hiroyuki, HIRAYAMA, Masami, KOMATSU, Akira
• Application Number:
  US10/906,375
• Publication Number:
  US 20050180010A1
• Time in Patent Office: Days
• US Class Current: 359/497
• CPC Class Codes: G02B 13/002 having at least one aspherical surface
• CPC Class Codes: G02B 27/46 Systems using spatial filters
• CPC Class Codes: G02B 5/282 reflecting for infrared and transparent for visible light, e.g. heat reflectors, laser protection
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

A dielectric multilayer filter includes a light-transmissive substrate having a flat surface on at least one side with a dielectric multilayer film formed on the flat surface. The dielectric multilayer film reflects light of a particular wavelength. A resin focusing lens is on one side of the light-transmissive substrate.

Claims

1. A dielectric multilayer filter comprising:

a light-transmissive substrate having sides, at least one side having a flat surface;

a dielectric multilayer film on the flat surface, for reflecting light of a particular wavelength range; and

a focusing lens comprising a resin, disposed over one of the sides of the light-transmissive substrate.

2. The dielectric multilayer filter of claim 1, wherein the light-transmissive substrate has a birefringent plate.

3. The dielectric multilayer filter of claim 1, wherein the light-transmissive substrate is an optical low-pass filter comprising:

a first birefringent plate,

a second birefringent plate, and

a polymer film, serving as a quarter wave plate, sandwiched between the first birefringent plate and the second birefringent plate.

4. The dielectric multilayer filter of claim 1, wherein the light-transmissive substrate is an absorption-type filter for absorbing light of a particular wavelength range.

5. The dielectric multilayer filter of claim 1, wherein an outer surface of the focusing lens is aspheric.

6. The dielectric multilayer filter of claim 1, wherein a half value of the dielectric multilayer film is in a range of 650±

30 nm, the half value being a wavelength indicating half of a maximum transmittance of the film.

7. A method of manufacturing dielectric multilayer filters, comprising:

preparing a hybrid lens molding unit of;

a light-transmissive substrate in a plate form, having two opposed sides and, on at least one of the sides, a dielectric multilayer film for reflecting light of a particular wavelength range, and

a convex face-forming molding die having a shaping face and concavities, each of the concavities being adapted to transfer a focusing lens form onto a target surface provided in the shaping face, with the shaping face facing the light-transmissive substrate;

charging a curable composition-based material into the concavities of the hybrid lens molding unit;

curing the curable composition-based material to form resin focusing lenses;

removing the convex face-forming molding die; and

dicing the light-transmissive substrate.

8. A solid-state imaging device, comprising:

a package having an opening;

a solid-state imaging element, disposed inside the package so as to face the opening; and

a light-transmissive, dust-tight cover obturating the opening;

wherein said dust-tight cover is a dielectric multilayer filter having;

a light-transmissive substrate;

a dielectric multilayer film for reflecting light of a particular wavelength range, disposed on at least one side of the light-transmissive substrate; and

a resin focusing lens disposed on a light-incident side of the light-transmissive substrate.