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Global network computers

  • US 20050180095A1
  • Filed: 10/15/2003
  • Published: 08/18/2005
  • Est. Priority Date: 11/29/1996
  • Status: Abandoned Application
First Claim
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1. A microchip comprising:

  • a plurality of dies, each made by a separate fabrication process and assembled into a package with the separate die sections connected directly.

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