Global network computers
First Claim
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1. A microchip comprising:
- a plurality of dies, each made by a separate fabrication process and assembled into a package with the separate die sections connected directly.
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Abstract
Embodiments useful for a network of computers are presented. In an embodiment, a microchip includes a plurality of dies. Each die is made by a separate fabrication process and assembled into a package with the separate die sections connected directly.
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2 Claims
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1. A microchip comprising:
a plurality of dies, each made by a separate fabrication process and assembled into a package with the separate die sections connected directly. - View Dependent Claims (2)
Specification