Heat transfer mechanism, heat dissipation system, and communication apparatus

• US 20050180113A1
• Filed: 06/18/2004
• Published: 08/18/2005
• Est. Priority Date: 02/13/2004
• Status: Active Grant

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Ueda, Satoshi, Yamazaki, Naoya, Iino, Kazuhiro, Tada, Yoshiaki, Shirakami, Takashi
• Granted Patent: US 7,663,883 B2
• Time in Patent Office: Days
• US Class Current: 361/704
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28F 13/00 Arrangements for modifying heat-transfer, e.g. increasing, decreasing F28F1/00 - F28F11/00 take precedence
• CPC Class Codes: F28F 2013/005 Thermal joints
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/373 Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons

Abstract

A heat transfer mechanism for dissipating heat from a heat generating body to a heat dissipating part, realizing both a high elasticity and a high thermal conductivity, comprised of a film-shaped heat conductor for transferring heat to the heat dissipating part and an elastic member for imparting elasticity to the film-shaped heat conductor, the film-shaped heat conductor being formed from metal foil-type flexible heat pipes or carbon-based thermal conductive sheets.

Claims

1. A heat transfer mechanism for dissipating heat from a heat generating body from a heat dissipating part, comprised of:

a film-shaped heat conductor for transferring heat from the heat generating body to the heat dissipating part and

an elastic member for imparting elasticity to the film-shaped heat conductor,

said film-shaped heat conductor being formed from a metal foil-type flexible heat pipe.

2. A heat transfer mechanism as set forth in claim 1, wherein:

said film-shaped heat conductor is U-shaped in side cross-section and transfers heat from the heat generating body to the heat dissipating part along the U-shape, and

said elastic member is inserted into this U-shape.

3. A heat transfer mechanism as set forth in claim 1, wherein:

said film-shaped heat conductor has a step shape in side cross-section and transfers heat from the heat generating body to the heat dissipating part along the step, and

said elastic member is provided at the step part.

4. A heat transfer mechanism as set forth in claim 1, wherein said elastic member is comprised of a polymer-based member.

5. A heat transfer mechanism as set forth in claim 1, wherein parts for interconnecting said heat generating body, said film-shaped heat conductor, said elastic member, and said heat dissipating part are tightly fixed by bonding members.

6. A heat transfer mechanism as set forth in claim 1, further provided with tight fixing means for clamping said heat generating body, said film-shaped heat conductor, and said elastic member between a board mounting said heat generating body and said heat diffusion plate forming said heat dissipating part.

7. A heat transfer mechanism for dissipating heat from a heat generating body from a heat dissipating part, comprised of:

a film-shaped heat conductor for transferring heat from the heat generating body to the heat dissipating part and

an elastic member for imparting elasticity to the film-shaped heat conductor,

said film-shaped heat conductor being formed from a carbon-based thermal conductive sheet.

8. A heat transfer mechanism as set forth in claim 7, wherein said carbon-based thermal conductive sheet forming said film-shaped heat conductor is formed from a graphite sheet.

9. A heat transfer mechanism as set forth in claim 7, wherein said carbon-based thermal conductive sheet forming said film-shaped heat conductor is formed from a carbon nanotube sheet.

10. A heat transfer mechanism as set forth in claim 7, wherein:

said film-shaped heat conductor is U-shaped in side cross-section and transfers heat from the heat generating body to the heat dissipating part along the U-shape, and

said elastic member is inserted into this U-shape.

11. A heat transfer mechanism as set forth in claim 7, wherein said film-shaped heat conductor is O-shaped in side cross-section so as to completely enclose said elastic member and transfers heat from said heat generating body to said heat dissipating part along this O-shape.

12. A heat transfer mechanism as set forth in claim 7, wherein said elastic member is comprised of a polymer-based member.

13. A heat transfer mechanism as set forth in claim 7, wherein parts for interconnecting said heat generating body, said film-shaped heat conductor, said elastic member, and said heat dissipating part are tightly fixed by bonding members.

14. A heat transfer mechanism as set forth in claim 7, further provided with a tight fixing means for clamping said heat generating body, said film-shaped heat conductor, and said elastic member between a board mounting said heat generating body and said heat diffusion plate forming said heat dissipating part.

15. A heat dissipation system dissipating heat generated from heat generating bodies mounted on a common board through a heat transfer mechanism from a common heat dissipating part, wherein:

said heat transfer mechanism is comprised of, for each heat generating body, a film-shaped heat conductor transferring heat from a heat generating body to said heat dissipating part and an elastic member for imparting elasticity to said film-shaped heat conductor, and

said film-shaped heat conductor is formed from a metal foil type flexible heat pipe.

17. A heat dissipation system as set forth in claim 15, wherein said heat dissipating part houses heat pipe.

19. A communication apparatus provided with heat generating bodies constituted by IC packages and with a heat dissipation system for dissipating heat from said heat generating bodies, wherein said heat dissipation system is a heat dissipation system as set forth in claim 15.

16. A heat dissipation system dissipating heat generated from heat generating bodies mounted on a common board through a heat transfer mechanism from a common heat dissipating part, wherein:

said heat transfer mechanism is comprised of, for each heat generating body, a film-shaped heat conductor transferring heat from a heat generating body to said heat dissipating part and an elastic member for imparting elasticity to said film-shaped heat conductor, and

said film-shaped heat conductor is formed from a carbon-based thermal conductive sheet.

18. A heat dissipation system as set forth in claim 16, wherein said heat dissipating part houses heat pipe.

20. A communication apparatus provided with heat generating bodies constituted by IC packages and with a heat dissipation system for dissipating heat from said heat generating bodies, wherein said heat dissipation system is a heat dissipation system as set forth in claim 16.