Apparatus for fabricating surface emitting semiconductor laser

• US 20050180478A1
• Filed: 04/14/2005
• Published: 08/18/2005
• Est. Priority Date: 09/02/2002
• Status: Active Grant

• Current Assignee: Fujifilm Business Innovation Corp. (Fujifilm Holdings Corporation)
• Original Assignee: Fuji Xerox Company Limited (Xerox Holdings Corp.)
• Inventors: Sakamoto, Akira, Sakurai, Jun, Nakayama, Hideo, Miyamoto, Yasuaki
• Granted Patent: US 7,079,562 B2
• Time in Patent Office: Days
• US Class Current: 372/50.100
• CPC Class Codes: H01S 5/18311 using selective oxidation
• CPC Class Codes: H01S 5/18358 containing spacer layers to adjust the phase of the light wave in the cavity
• CPC Class Codes: H01S 5/2086 lateral etch control, e.g. mask induced

Abstract

A method of fabricating a surface emitting semiconductor laser includes a first step of forming, on a substrate, multiple monitor-use semiconductor layers having stripes radiating from a center of the substrate, and a laser portion that includes semiconductor layers and is located on the periphery of the multiple monitor-use semiconductor layers, a second step of monitoring oxidized conditions on the multiple monitor-use semiconductor layers when a selectively oxidized region is formed in the laser portion, and a third step of controlling oxidization of the selectively oxidized region on the basis of the oxidized conditions thus monitored.

Claims

1. An apparatus for fabricating a surface emitting semiconductor laser comprising:

a projection part projecting light onto an area including at least two kinds of monitor-use mesas respectively including III-V semiconductor layers that contain Al and have side surfaces exposed, when the side surfaces and a side surface of a III-V semiconductor layer of a laser-use mesa that contains Al and a side surface exposed are oxidized;

a photoelectric conversion part converting reflected lights from the monitor-use mesas into electrical signals;

an oxidization terminating time estimation part that detects times when the III-V semiconductor layers of the two kinds of monitor-use mesas are totally oxidized on the basis of the electrical signals, and estimates an oxidization terminating time when oxidization of the III-V semiconductor layer of the laser-use mesa should be terminated; and

an oxidization control part causing oxidization of the III-V semiconductor layer of the laser-use mesa to be terminated at the oxidization terminating time to thus define a current confinement layer in the laser-use mesa.

2. The apparatus as claimed in claim 1, wherein the oxidization terminating time estimation part estimates an oxidization time corresponding to an oxidization distance to be formed in the laser-use mesa on the basis of the times when the III-V semiconductor layers of the two kinds of monitor-use mesas are totally oxidized and oxidization distances thereof.

3. The apparatus as claimed in claim 1, wherein the projection part projects light onto multiple stripe patterns formed on the substrate, in which each of the multiple stripe patterns is formed by the at least two kinds of monitor-use mesas.

4. The apparatus as claimed in claim 3, wherein the projection part projects light onto the area including at least two kinds of monitor-use mesas radiating from a center of the substrate.