Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
First Claim
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30. A wafer assembly comprising:
- a lower semiconductor wafer comprising a plurality of mirror device areas, each mirror device area comprising a mirror array having mirrors disposed in a rectangular array area;
wherein the mirrors have mirror edges that are neither parallel nor perpendicular to edges of the rectangular array area;
an upper light transmissive wafer bonded in spaced apart relationship to the lower wafer; and
one or more intermediate wafers bonded between the upper and lower wafer and having open areas corresponding to each mirror device location.
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Abstract
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
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Citations
54 Claims
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30. A wafer assembly comprising:
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a lower semiconductor wafer comprising a plurality of mirror device areas, each mirror device area comprising a mirror array having mirrors disposed in a rectangular array area;
wherein the mirrors have mirror edges that are neither parallel nor perpendicular to edges of the rectangular array area;
an upper light transmissive wafer bonded in spaced apart relationship to the lower wafer; and
one or more intermediate wafers bonded between the upper and lower wafer and having open areas corresponding to each mirror device location. - View Dependent Claims (1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54)
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31-1. The wafer assembly of claim 30, wherein the mirror edges are approximately 45 degrees relative to the rectangular array area edges.
Specification