Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
First Claim
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1. A method for making a plurality of spatial light modulator, comprising:
- providing a transparent wafer and a semiconductor wafer;
forming a plurality of micromirrors within a plurality of rectangular micromirror arrays on the semiconductor wafer;
wherein the mirrors are formed on semiconductor wafer in a rectangular array area, and wherein the mirrors have mirror edges that are neither parallel nor perpendicular to edges of the rectangular array area;
bonding the transparent wafer and semiconductor wafer together with a spacer layer therebetween so as to form gaps in which the micromirrors of the micromirror arrays are disposed;
wherein the bonding is performed by an application of an adhesive, an application of pressure to press the transparent wafer and semiconductor wafer together, and a step of curing the adhesive so as to form a wafer assembly; and
singulating the wafer assembly into individual spatial light modulators.
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Abstract
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
129 Citations
40 Claims
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1. A method for making a plurality of spatial light modulator, comprising:
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providing a transparent wafer and a semiconductor wafer;
forming a plurality of micromirrors within a plurality of rectangular micromirror arrays on the semiconductor wafer;
wherein the mirrors are formed on semiconductor wafer in a rectangular array area, and wherein the mirrors have mirror edges that are neither parallel nor perpendicular to edges of the rectangular array area;
bonding the transparent wafer and semiconductor wafer together with a spacer layer therebetween so as to form gaps in which the micromirrors of the micromirror arrays are disposed;
wherein the bonding is performed by an application of an adhesive, an application of pressure to press the transparent wafer and semiconductor wafer together, and a step of curing the adhesive so as to form a wafer assembly; and
singulating the wafer assembly into individual spatial light modulators. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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Specification