Method and apparatus for crystallizing silicon, method of forming a thin film transistor, a thin film transistor and a display apparatus using same

• US 20050181553A1
• Filed: 05/13/2004
• Published: 08/18/2005
• Est. Priority Date: 02/13/2004
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Dong-Byum, Chung, Ui-Jin, Chung, Se-Jin
• Application Number:
  US10/844,998
• Publication Number:
  US 20050181553A1
• Time in Patent Office: Days
• US Class Current: 438/166
• CPC Class Codes: B23K 26/0622 by shaping pulses
• CPC Class Codes: B23K 26/067 Dividing the beam into multiple beams, e.g. multifocusing
• CPC Class Codes: B23K 26/0673 into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
• CPC Class Codes: B23K 26/0732 into a rectangular shape
• CPC Class Codes: B23K 26/0736 into an oval shape, e.g. elliptic shape
• CPC Class Codes: H01L 21/02532 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02595 polycrystalline
• CPC Class Codes: H01L 21/02678 Beam shaping, e.g. using a mask
• CPC Class Codes: H01L 21/02686 Pulsed laser beam
• CPC Class Codes: H01L 21/02691 Scanning of a beam
• CPC Class Codes: H01L 29/66765 Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
• CPC Class Codes: H01L 29/78678 with inverted-type structure, e.g. with bottom gate

Abstract

A light having a pulse frequency higher than about 300 Hz is generated. The light is irradiated on an amorphous silicon thin film for a predetermined time period to form an initial polysilicon crystal. The light is transported in a predetermined direction to grow the initial polysilicon crystal. A laser beam having a decreased output energy is irradiated on the amorphous silicon thin film to crystallize the amorphous silicon thin film to a polysilicon thin film so that the load of an apparatus for generating the laser beam is decreased, and the lifetime of the apparatus for generating the laser beam increases.

Claims

1. A method of crystallizing silicon, comprising:

generating light having a pulse frequency higher than about 300 Hz;

irradiating the light on at least one amorphous silicon thin film for a predetermined time period to form an initial polysilicon crystal; and

transporting the light in a predetermined direction to grow the initial polysilicon crystal.

2. The method as recited in claim 1, wherein the pulse frequency is in the range of about 300 Hz to about 4 KHz.

3. The method as recited in claim 1, wherein the pulse frequency is higher than about 4 KHz.

4. The method as recited in claim 1, wherein the light has a rectangular shape.

5. The method as recited in claim 1, wherein the step of transporting the light occurs continuously or intermittently.

6. The method as recited in claim 5, further comprising adjusting the velocity of transportation when the light is continuously transported.

7. The method as recited in claim 5, wherein an interval of transportation of the light is about 1 μ

m to about 10 μ

m when the light is intermittently transported.

8. The method as recited in claim 1, wherein the light has an output energy in the range of about 100 mJ to about 1 J.

9. A method of crystallizing silicon, comprising:

generating light having a pulse frequency higher than about 300 Hz;

dividing the light into a plurality of light portions;

irradiating each of the plurality of light portions on a respective amorphous silicon thin film of a plurality of amorphous silicon thin films for a predetermined time period to form a plurality of initial polysilicon crystals; and

transporting each of the plurality of light portions in a predetermined direction to grow the plurality of initial polysilicon crystals.

10. The method as recited in claim 9, wherein each of the plurality of light portions has the pulse frequency higher than about 300 Hz.

11. The method as recited in claim 9, wherein the pulse frequency is in the range of about 300 Hz to about 4 KHz.

12. The method as recited in claim 9, wherein the pulse frequency is higher than about 4 KHz.

13. The method as recited in claim 9, wherein each of the plurality of light portions has a rectangular shape.

14. The method as recited in claim 9, wherein the step of transporting each of the plurality of light portions occurs continuously or intermittently.

15. The method as recited in claim 14, further comprising adjusting the velocity of transportation when each of the plurality of light portions is continuously transported.

16. The method as recited in claim 14, wherein an interval of transportation of each of the plurality of light portions is about 1 μ

m to about 10 μ

m when each of the plurality of light portions is intermittently transported.

17. The method as recited in claim 9, wherein the light has an output energy in the range of about 100 mJ to about 1 J.

18. The method as recited in claim 9, wherein each of the plurality of light portions has an output energy less than the output energy of the light.

19. An apparatus for crystallizing silicon, comprising:

an attenuator positioned to receive a primary beam having a pulse frequency higher than about 300 Hz from a light source and for generating an attenuated beam;

a concentrator for concentrating the attenuated beam and generating a concentrated beam; and

a light shape transformer for transforming a shape of the concentrated beam and generating a transformed beam, wherein the transformed beam is irradiated on an amorphous silicon thin film to form a polysilicon thin film.

20. The apparatus as recited in claim 19, wherein the pulse frequency is in the range of about 300 Hz to about 4 KHz.

21. The apparatus as recited in claim 19, wherein the pulse frequency is higher than about 4 KHz.

22. The apparatus as recited in claim 19, further comprising a transporting unit for transporting one of the amorphous silicon thin film or the light shape transformer so that the transformed beam is transported along the amorphous silicon thin film to grow polysilicon crystal.

23. The apparatus as recited in claim 19, further comprising a mirror for changing a direction of the attenuated beam.

24. The apparatus as recited in claim 19, further comprising a mirror for changing a direction of the concentrated beam.

25. The apparatus as recited in claim 19, wherein a cross-section of each of the primary beam, the attenuated beam and the concentrated beam is a circular shape.

26. The apparatus as recited in claim 19, wherein the shape of the concentrated beam is transformed into an elliptical shape or a rectangular shape.

27. The apparatus as recited in claim 19, wherein a cross-sectional length of the concentrated beam is not less than about 700 mm.

28. The apparatus as recited in claim 19, wherein the cross-sectional width of the concentrated beam is not more than about 5 μ

m.

29. An apparatus for crystallizing silicon, comprising:

a light source for generating a primary beam having a pulse frequency higher than about 300 Hz;

an attenuator positioned adjacent to the light source for generating an attenuated beam;

a concentrator positioned adjacent to the attenuator for concentrating the attenuated beam and generating a concentrated beam;

a beam divider positioned adjacent to the concentrator for dividing the concentrated beam into at least two beams; and

at least two light shape transformers positioned adjacent to the beam divider for respectively transforming a shape of each of the at least two beams and generating at least two respective transformed beams, wherein the at least two respective transformed beams are respectively irradiated on at least two amorphous silicon thin films to form at least two polysilicon thin films.

30. The apparatus as recited in claim 29, wherein the pulse frequency is in the range of about 300 Hz to about 4 KHz.

31. The apparatus as recited in claim 29, wherein the pulse frequency is higher than about 4 KHz.

32. The apparatus as recited in claim 29, wherein a cross-section of each of the primary beam, the attenuated beam, the concentrated beam and the at least two beams is a circular shape.

33. The apparatus as recited in claim 29, wherein the shape of each of the at least two beams is transformed into an elliptical shape or a rectangular shape.

34. The apparatus as recited in claim 29, wherein the beam divider includes a plurality of dividing lenses disposed one of parallelly, serially and in a matrix shape.

35. A method of forming a thin film transistor, comprising:

forming a gate electrode on a substrate;

forming a first insulating layer on the substrate having the gate electrode formed thereon;

forming an amorphous silicon thin film on the first insulating layer;

irradiating light having a pulse frequency in the range of about 300 Hz to about 4 kHz on the amorphous silicon thin film;

transporting the light in a predetermined direction to grow polysilicon crystals to form a polysilicon thin film; and

patterning the polysilicon thin film to form a polysilicon layer on the first insulating layer.

36. The method as recited in claim 35, further comprising forming a second insulating layer on the first insulating including the polysilicon layer, wherein the second insulating includes a first contact hole and a second contact hole exposing the polysilicon layer.

37. The method as recited in claim 35, further comprising forming a source electrode and a drain electrode on the second insulating layer corresponding to the first and second contact holes, wherein the source electrode is electrically connected to the polysilicon layer through the first contact hole and the drain electrode is electrically connected to the polysilicon layer through the second contact hole.

38. A thin film transistor comprising:

a gate electrode formed on a substrate;

a first insulating layer formed on the substrate including the gate electrode formed thereon; and

a channel layer disposed on the first insulating layer, wherein the channel layer includes a plurality of polysilicon crystals arranged in a predetermined crystal growth direction.

39. The thin film transistor as recited in claim 38, further comprising:

a second insulating layer disposed on the channel layer including a first contact hole and a second contact hole; and

a source electrode and a drain electrode formed on the second insulating layer, wherein the source electrode is electrically connected to the channel layer through the first contact hole and the drain electrode is electrically connected to the channel layer through the second contact hole.

40. The thin film transistor as recited in claim 38, wherein the plurality of polysilicon crystals are parallelly disposed with respect to each other.

41. The thin film transistor as recited in claim 38, wherein the predetermined crystal growth direction is substantially parallel to a transporting direction of a laser beam for forming the plurality of polysilicon crystals.

42. The thin film transistor as recited in claim 41, wherein the laser beam has a pulse frequency in the range of about 300 Hz to about 4 KHz.

43. A liquid crystal display apparatus including the thin film transistor as recited in claim 38.

44. A display apparatus, comprising:

a first substrate including a thin film transistor and a pixel electrode; and

a second substrate including a common electrode, wherein a liquid crystal layer is capable of being interposed between the first and second substrates, and the thin film transistor includes;

a gate electrode formed on a transparent substrate;

a first insulating layer formed on the transparent substrate including the gate electrode formed thereon; and

a channel layer disposed on the first insulating layer, wherein the channel layer includes a plurality of polysilicon crystals arranged in a predetermined crystal growth direction.

45. The display apparatus as recited in claim 44, wherein the plurality of polysilicon crystals are parallelly disposed with respect to each other.

46. The display apparatus as recited in claim 44, wherein the predetermined crystal growth direction is substantially parallel to with a transporting direction of a laser beam for forming the plurality of polysilicon crystals.

47. The display apparatus as recited in claim 46, wherein the laser beam has a pulse frequency in the range of about 300 Hz to about 4 KHz.