Ion implantation

• US 20050181584A1
• Filed: 01/06/2005
• Published: 08/18/2005
• Est. Priority Date: 01/09/2004
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Wells, Stephen, Kindersley, Peter, Farley, Marvin, Ryding, Geoffrey, Sakase, Takao, Foad, Majeed, Harrison, Bernard
• Application Number:
  US11/029,646
• Publication Number:
  US 20050181584A1
• Time in Patent Office: Days
• US Class Current: 438/514
• CPC Class Codes: H01J 2237/082 Electron beam
• CPC Class Codes: H01J 2237/20228 Mechanical X-Y scanning
• CPC Class Codes: H01J 2237/2485 Electric or electronic means
• CPC Class Codes: H01J 2237/30455 Correction during exposure
• CPC Class Codes: H01J 2237/30488 Raster scan
• CPC Class Codes: H01J 37/08 Ion sources; Ion guns
• CPC Class Codes: H01J 37/3023 Programme control
• CPC Class Codes: H01J 37/304 Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
• CPC Class Codes: H01J 37/3171 for ion implantation plasma immersion ion implantation H01J37/32412

Abstract

This invention relates to a method of implanting ions in a substrate using an ion beam where instabilities in the ion beam may be present and to an ion implanter for use with such a method. This invention also relates to an ion source for generating an ion beam that can be switched off rapidly. In essence, the invention provides a method of implanting ions comprising switching off the ion beam when an instability has been detected whilst continuing motion of the substrate relative to the ion beam to leave an unimplanted portion of a scan line across the substrate, establishing a stable ion beam once more and finishing the scan line by implanting the unimplanted portion of the path.

Claims

1. A method of implanting ions in a substrate using an ion beam having cross-sectional dimensions smaller that the substrate comprising the steps of:

(a) establishing a stable ion beam with the substrate clear of the ion beam;

(b) implanting the substrate by causing relative motion between the ion beam and the substrate such that the ion beam traverses the substrate along at least one path;

(c) monitoring the ion beam for instabilities during step (b);

(d) upon detecting an ion beam instability, switching off the ion beam as the relative motion continues to leave an unimplanted portion of the path;

(e) recording an off position corresponding to the ion beam'"'"'s position relative to the substrate when the ion beam is switched off in step (d);

(f) establishing a stable ion beam once more; and

(g) continuing to implant the substrate by causing relative motion between the ion beam and the substrate along the unimplanted portion of the path.

2. A method according to claim 1, wherein step (f) comprises establishing a stable ion beam with the substrate clear of the ion beam prior to step (g);

step (g) comprises causing relative motion between the ion beam and the substrate such that the ion beam travels along said path in a reverse direction, that is in an opposite direction as for step (b), and switching off the ion beam when the ion beam crosses the off position.

3. A method according to claim 1, wherein step (g) comprises switching the ion beam on at the off position prior to the ion beam traversing the unimplanted portion of said path in the forward direction, that is the same direction as for step (b).

4. A method according to claim 3, wherein step (g) comprises causing relative motion between the ion beam and substrate in the forward direction from a point along said path such that the ion beam is switched on during the relative motion upon crossing the off position.

5. A method according to claim 2, further comprising:

repeating steps (c), (d) and (e) during step (g) such that, if a second beam instability is detected, a central portion of said path is not implanted; and

continuing to implant the substrate once more by causing relative motion between the ion beam and the substrate such that the ion beam travels across the substrate along the central portion of said path.

6. A method according to claim 5, comprising the steps of:

commencing the relative motion along said path outside of the central portion;

switching the beam on when first crossing an off position; and

switching the beam off when crossing the other off position.

7. A method according to claim 1, wherein step (c) comprises monitoring a return current.

30. A method according to any of claim 1, wherein the step of switching off the ion beam comprises switching off an ion source in accordance with claim 29.

8. A method of implanting ions in a substrate held in a substrate holder moveable bidirectionally along a first axis of translation, the method comprising the steps of:

(a) establishing a stable ion beam having cross-sectional dimensions smaller than the substrate with the ion beam clear of the substrate in a start position adjacent the substrate along the first axis;

(b) implanting the substrate by moving the substrate holder along the first axis such that the ion beam transverses the substrate along a first scan line and continues until clear of the substrate;

(c) causing relative motion between the ion beam and the substrate holder along a second axis;

(d) repeating steps (b) and (c) to implant a series of scan lines across the substrate;

(e) monitoring the ion beam during implantation in step (b) and as repeated according to step (d);

(f) upon detecting an ion beam instability, switching off the ion beam as the relative motion continues to leave an unimplanted portion of the scan line;

(g) recording an off position corresponding to the position of the substrate holder when the ion beam is switched off in step (f);

(h) establishing a stable ion beam once more;

(i) completing implantation of the scan line by moving the substrate holder along the first axis so that the ion beam scans over the unimplanted portion of the scan line; and

(j) completing implantation of the substrate by repeating steps (b) and (c) to complete the series of scan lines across the substrate.

9. A method according to claim 8, wherein step (c) comprises translating the substrate holder along a second axis of translation relative to a fixed ion beam, the first and second axes being perpendicular.

10. A method according to claim 8, wherein step (f) comprises continuing to move the substrate holder along the first axis after the ion beam is switched off such that, if the ion beam were still switched on, the ion beam completes the scan line and stops at a stop position.

11. A method according to claim 10, wherein step (h) comprises establishing a stable ion beam with the ion beam clear of the substrate at the stop position;

step (i) comprises moving the substrate holder along the first axis to follow the scan line in the reverse direction and switching off the ion beam during the movement of step (i) when the substrate holder passes through the off position.

12. A method according to claim 9, wherein step (h) comprises establishing a stable ion beam with the ion beam clear of the substrate at the stop position;

step (i) comprises moving the substrate holder along the first axis to follow the scan line in the reverse direction and switching off the ion beam during the movement of step (i) when the substrate holder passes through the off position and further comprising the step of determining whether the ion beam will strike the substrate holder upon restarting the ion beam in step (h) and, if yes, causing an effective relative motion between the ion beam and substrate holder along the second axis to a position where the ion beam can be established without striking the substrate or substrate holder before reciprocating the relative motion back to the stop position to allow step (i) to be performed.

13. A method according to claim 8, further comprising the steps of:

moving the substrate holder along the scan line in the reverse direction with the ion beam still switched off such that, if the ion beam were switched on, the ion beam returns to the start position;

moving the substrate holder back along the scan line in the forwards direction to complete the scan line with the ion beam initially switched off; and

restarting the ion beam during the movement back along the scan line in the forwards direction when the substrate holder passes through the off position.

14. A method according to claim 11, further comprising:

repeating steps (e), (f) and (g) during step (i) such that, if a second beam instability is detected whilst scanning in the reverse direction, a central portion of the scan line is not implanted;

stopping movement of the substrate holder after the ion beam has been switched off for the second time at a second off position; and

moving the substrate holder back along the scan line in the forward direction and, during this movement, turning the ion beam on when the substrate holder passes through the second off position and turning the ion beam off when the substrate holder passes through the first off position.

15. A method according to claim 8, wherein step (e) comprises monitoring a return current.

16. An ion implanter controller for an ion implanter operable to generate an ion beam for implanting into a substrate wherein the ion beam has cross-sectional dimensions smaller than the substrate, the controller comprising:

ion beam switching means operable to cause the ion beam to switch on and off;

scanning means operable to cause relative motion between the ion beam and the substrate such that the ion beam traverses the substrate along at least one path;

ion beam monitoring means operable to receive a signal indicative of the ion beam flux and to detect instabilities in the ion beam therefrom during said relative motion; and

indexing means operable to determine the position of the ion beam relative to the substrate during said relative motion;

wherein the controller is arranged such that;

the ion beam switching means is operable to cause the ion beam to switch off during the relative motion when the ion beam monitoring means detects an instability in the ion beam to leave an unimplanted portion of the path;

the indexing means records an off position of the ion beam relative to the substrate when the ion beam is switched off;

the ion beam switching means is operable to cause the ion beam to switch on once more; and

the scanning means is operable to cause relative motion between the ion beam and the substrate such that the ion beam traverses the substrate along the unimplanted part of the path.

17. A controller according to claim 16, wherein the controller is arranged such that:

the scanning means is operable to ensure the substrate is not in the way of the ion beam when the ion beam switching means cause the ion beam to switch on once more;

the ion beam monitoring means is operable to determine whether or not the ion beam is stable;

once the ion beam monitoring means indicates the ion beam to be stable, the scanning means is operable to cause relative motion between the substrate and ion beam such that the ion beam travels along said path in a reverse direction; and

the ion beam switching means is operable to cause the ion beam to switch off when the ion beam passes through the off position.

18. A controller according to claim 16, wherein the controller is arranged such that:

the scanning means is operable to cause effective relative motion between the ion beam and the substrate with the ion beam initially switched off such that, if the ion beam were switched on, the ion beam traverses at least a portion of the path in the same forwards direction, the portion including the unimplanted part of the path; and

the ion beam switching means is operable to cause the ion beam to switch on when the ion beam passes through the off position.

19. An ion implanter for implanting a substrate using an ion beam, comprising:

an ion source operable to generate the ion beam;

an ion beam monitor operable to detect instabilities in the ion beam;

a substrate holder moveable bidirectionally along a first axis of translation and operable to hold the substrate to be implanted; and

the controller of claim 16;

wherein;

the ion beam switching means is operable to cause the ion source to switch on or off thereby causing the ion beam to switch on and off;

the scanning means is operable to cause the substrate holder to move along the first axis thereby causing the ion beam to traverse the substrate along at least one path; and

the ion beam monitor is operable to supply the signal to the ion beam monitoring means upon detecting an instability.

20. An ion implanter according to claim 19, wherein the ion beam monitor is a return current detector.

21. An ion source for an ion implanter comprising:

a cathode, an anode, biasing means for biasing the anode relative to the cathode, a first switch, and a first electrical path connecting anode to cathode via the biasing means and the first switch arranged in series, wherein the first switch is operable to make or break the first electrical path.

22. An ion source according to claim 21, further comprising a second conductor path connecting anode to cathode with at least a portion that extends in parallel across the biasing means, the portion comprising a second switch operable to make or break the second electrical path.

23. An ion source according to claim 22, wherein the first switch is operable in response to a first binary switching signal and the second switch is operable in response to a second binary switching signal that is the complement of the first switching signal.

24. An ion source according to claim 23, further comprising a not gate operable to generate the complementary second switching signal from a portion of the first switching signal.

25. An ion source according to claim 21, wherein the first switch is a power semiconductor switch.

26. An ion source according to claim 22, wherein the second switch is a power semiconductor switch.

27. An ion implanter including the ion source of claim 21.

28. A method of switching off the ion source of claim 21, comprising the step of operating the first switch to break the first electrical path in response to detection of an instability in the ion beam generated by the ion source.

29. A method according to claim 28, further comprising increasing the power supplied to the cathode.