Methods of forming doped and un-doped strained semiconductor and semiconductor films by gas-cluster ion irradiation
First Claim
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1. A method for forming one or more strained regions in a semiconductor substrate, comprising the steps of:
- maintaining a reduced-pressure environment around a substrate holder for holding a semiconductor substrate having a surface;
holding the semiconductor substrate securely within said reduced-pressure environment;
providing to said reduced-pressure environment a gas-cluster ion beam from a pressurized gas mixture including at least one strain-inducing atom species;
accelerating the gas-cluster ion beam; and
irradiating the accelerated gas-cluster ion beam onto one or more portions of the surface of the semiconductor substrate to form one or more strained semiconductor regions within the substrate.
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Abstract
Methods and apparatus are described for irradiating one or more substrate surfaces with accelerated gas clusters including strain-inducing atoms for blanket and/or localized introduction of such atoms into semiconductor substrates, with additional, optional introduction of dopant atoms and/or C. Processes for forming semiconductor films infused into and/or deposited onto the surfaces of semiconductor and/or dielectric substrates are also described. Such films may be doped and/or strained as well.
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Citations
48 Claims
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1. A method for forming one or more strained regions in a semiconductor substrate, comprising the steps of:
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maintaining a reduced-pressure environment around a substrate holder for holding a semiconductor substrate having a surface;
holding the semiconductor substrate securely within said reduced-pressure environment;
providing to said reduced-pressure environment a gas-cluster ion beam from a pressurized gas mixture including at least one strain-inducing atom species;
accelerating the gas-cluster ion beam; and
irradiating the accelerated gas-cluster ion beam onto one or more portions of the surface of the semiconductor substrate to form one or more strained semiconductor regions within the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 36, 38, 39, 40, 41)
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17. A method for forming a semiconductor thin film at a surface of a substrate, comprising the steps of:
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maintaining a reduced-pressure environment around a substrate holder for holding a substrate having a surface;
holding the substrate securely within said reduced-pressure environment;
providing to said reduced-pressure environment a gas-cluster ion beam from a pressurized gas mixture including at least one semiconductor atom species;
accelerating the gas-cluster ion beam; and
irradiating the accelerated gas-cluster ion beam onto at least a portion of the surface of the substrate to form a semiconductor thin film. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 37, 42, 43, 44, 45, 46, 47, 48)
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Specification