Multi-layer circuit board with thermal diffusion and method of fabricating the same

• US 20050183882A1
• Filed: 02/01/2005
• Published: 08/25/2005
• Est. Priority Date: 02/23/2004
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Yun, Young, So, Byun-Se, Ahn, Young-Man, Han, You-Keun
• Application Number:
  US11/048,678
• Publication Number:
  US 20050183882A1
• Time in Patent Office: Days
• US Class Current: 174/250
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 2201/0352 Differences between the conductors of different layers of a multilayer
• CPC Class Codes: H05K 2201/09736 Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
• CPC Class Codes: H05K 3/4641 having integrally laminated metal sheets or special power cores

Abstract

A multi-layer circuit board having an improved heat spreading performance is described. In a multi-layer circuit board structure configured such that insulating layers and interconnection conductive layers are alternately stacked, the interconnection conductive layers include a top interconnection conductive layer having a main surface on which circuit elements are mounted, a bottom interconnection conductive layer as a bottom surface layer facing the top interconnection conductive layer, an inner power conductive layer having a predetermined thickness, disposed between the top interconnection conductive layer and the bottom interconnection conductive layer, with some of the insulating layers interposed between the top and bottom interconnection conductive layers. The interconnection conductive layers can be of various thicknesses to facilitate heat diffusion. Heat diffusion can be accomplished with variations in thickness of either the insulating layers or electrically conductive layers. Heat diffusion performance is improved in comparison with a conventional circuit board assembly, thereby minimizing or reducing sizes of elements of a heat diffuser, or omitting the installation of a heat diffuser.

Claims

1. A multi-layer circuit board having a stacked-layer structure, comprising:

an outer layer;

a first inner layer; and

a second inner layer, which comprises the same material as the first inner layer,

a third layer disposed between said first and second inner layers, the third inner layer comprising a different material than said first and second inner layers;

wherein the first inner layer and the second inner layer have a different thickness from each other.

2. The multi-layer circuit board according to claim 1, wherein the outer layer, the first inner layer, and the second inner layer comprising an electrically conductive material.

3. The multi-layer circuit board according to claim 1, wherein the first inner layer is thicker than the second inner layer.

4. The multi-layer circuit board according to claim 1, wherein said thicker layer is a VDD layer.

5. The multi-layer circuit board according to claim 1 further comprising an external heat diffuser.

8. The multi-layer circuit board according to claim 4, wherein the first inner layer is disposed closer to the outer layer than the second inner layer.

9. The multi-layer circuit board according to claim 8, wherein the first inner layer is disposed closer to the nearest outer layer than the second inner layer is disposed to the nearest outer layer.

10. The multi-layer circuit board according to claim 4, wherein the first inner layer is a power conductive layer, and the second inner layer is a signal routing layer.

6. A multi-layer circuit board comprising:

an outer layer composed of a conductive material;

a first inner layer composed of a conductive material; and

a second inner layer composed of a conductive material,

wherein the first inner layer'"'"'s continuous cross sectional thickness is greater than the second inner layer'"'"'s continuous cross sectional thickness.

7. A multi-layer circuit board comprising:

an outer layer comprising a conductive material;

a first inner layer comprising a conductive material; and

a second inner layer comprising a conductive material,

wherein the first inner layer'"'"'s minimum thickness is greater than the second inner layer'"'"'s minimum thickness.

11. A multi-layer circuit board comprising:

a first outer layer composed of a conductive material;

a first inner layer composed of a conductive material;

a second inner layer composed of a conductive material;

a second outer layer composed of a conductive material;

a third inner layer composed of a conductive material; and

a fourth inner layer composed of a conductive material,

wherein the first inner layer is thicker than the second inner layer, and the fourth inner layer is thicker than the third inner layer.

12. The multi-layer circuit board according to claim 11, wherein the first inner layer and fourth inner layer are disposed substantially symmetrical about the center of the layers of the multi-layer circuit board.

13. A multi-layer circuit board comprising:

a first inner layer for transmitting power; and

a second inner layer for transmitting signals,

wherein the first inner layer is thicker than the second inner layer.

14. The multi-layer circuit board according to claim 13, wherein the first inner layer is thicker than the second inner layer by a factor of about two or more.

15. A multi-layer circuit board comprising:

a first inner layer for transmitting power;

a second inner layer for transmitting signals;

a third inner layer for transmitting signals; and

a fourth inner layer for transmitting power,

wherein the first inner layer is thicker than the second inner layer, and the fourth inner layer is thicker than the third inner layer.

16. A method of fabricating a multi-layer circuit board comprising:

forming a first inner layer, comprising a conductive material, with a predetermined thickness; and

forming a second inner layer, comprising a conductive material, with a thickness smaller than that of the first inner layer.

17. A printed circuit board having a memory module mounted thereon comprising:

an outer layer;

a first inner layer; and

a second inner layer comprising the same material as the first inner layer,

wherein the first inner layer and the second inner layer have different thicknesses.

18. The printed circuit board according to claim 17, wherein the outer layer, the first inner layer, and the second inner layer comprising a conductive material.

19. The printed circuit board according to claim 17, wherein the first inner layer and the second inner layer are comprised of a conductive material.

20. The printed circuit board according to claim 17, wherein the first inner layer is thicker than the second inner layer.

27. The method according to claim 20, wherein the inner interconnection conductive layers are comprised of copper, and comprise power conductive layers and signal routing conductive layers.

28. The method according to claim 27, wherein thicknesses of the power conductive layers is greater than those of the signal routing conductive layers.

21. A printed circuit substrate having a memory module mounted thereon comprising:

an outer layer comprised of a conductive material;

a first inner layer comprised of a conductive material; and

a second inner layer comprised of a conductive material,

wherein the first inner layer is thicker than the second inner layer.

22. A multi-layer circuit board structure configured such that insulating layers and interconnection conductive layers are alternately stacked, wherein

among the interconnection conductive layers, at least one inner interconnection conductive layers, is of a different thickness than at least one other inner conductive layer which are disposed under an outer interconnection conductive layer having a main surface on which circuit elements are capable of being mounted.

23. The multi-layer circuit board structure according to claim 22, wherein the inner interconnection conductive layers comprise power conductive layers and signal routing conductive layers.

24. A multi-layer circuit board structure configured such that insulating layers and interconnection conductive layers are alternately stacked, wherein

the interconnection conductive layers comprise:

a top interconnection conductive layer having a main surface to which circuit elements are operatively connected;

a bottom interconnection conductive layer facing the top interconnection conductive layer;

an inner power conductive layer, having a predetermined thickness, disposed between the top interconnection conductive layer and the bottom interconnection conductive layer; and

an inner signal routing conductive layer, having a thickness less than that of the inner power conductive layer, disposed between the inner power conductive layer and the bottom interconnection conductive layer.

25. The multi-layer circuit board structure according to claim 24, wherein the insulating layers are prepreg layers, and the interconnection conductive layers are copper layers.

26. A method of fabricating a multi-layer circuit board configured such that insulating layers and interconnection conductive layers are alternately stacked, comprising forming inner interconnection conductive layers between outer conductive layers, wherein at least one inner interconnection conductive layers is formed thicker than at least one other inner interconnection conductive layers, thereby improving heat spreading performance of the multi-layer circuit board.

29. A multi-layer circuit board structure configured such that insulating layers and interconnection conductive layers are alternately stacked, wherein

the interconnection conductive layers comprise:

a top interconnection conductive layer having a main surface on which circuit elements are capable of being mounted;

a bottom interconnection conductive layer as a bottom surface layer facing the top interconnection conductive layer;

an inner power conductive layer having a first predetermined thickness, disposed between the top interconnection conductive layer and the bottom interconnection conductive layer, with insulating layers interposed between the top and bottom interconnection conductive layers; and

an inner signal routing conductive layer disposed between the inner power conductive layer and the bottom interconnection conductive layer, having a second predetermined thickness greater than said first predetermined thickness.

30. The multi-layer circuit board structure according to claim 29, wherein the insulating layers are prepreg layers, and the interconnection conductive layers are copper.

31. The multi-layer circuit board structure according to claim 30, wherein the inner power conductive layers are copper layers for transmitting a power voltage or a ground voltage.

32. A multi-chip module structure having electronic circuit elements mounted thereon and using a multi-layer circuit board configured such that insulating layers and interconnection conductive layers are alternately stacked, comprising:

outer interconnection conductive layer having a main surface on which the electronic circuit elements are mounted;

inner interconnection conductive layers disposed under said outer interconnection conductive layer, wherein at least one thickness of an inner interconnection layer has a thickness different from at least one other inner interconnection layer;

a heat diffuser installed between a surface of a package of some of the electronic circuit elements and a surface of the multi-layer circuit board, for diffusing heat generated by operation of the electronic circuit elements out of the circuit board.

33. The multi-chip module structure according to claim 32, wherein the inner interconnection conductive layers comprise power conductive layers and signal routing conductive layers.

34. The multi-chip module structure according to claim 33, wherein a thickness of the power conductive layer is greater than that of the signal routing conductive layer.

35. The multi-chip module structure according to claim 33, wherein a thickness of the signal routing conductive layer is greater than that of the power conductive layer.

36. The multi-chip module structure according to claim 33, wherein the electronic circuit elements comprise at least DRAM chips.

37. A method of forming a multi-layered circuit board comprising:

determining the number of conductive and insulating layers in the multi-layered circuit board;

forming selected layers to be of a relatively different thickness than other layers.

38. The method of claim 37 wherein said selected layers of a relatively different thickness are insulating layers.

39. The method of claim 37 wherein said selected layers of a relatively different thickness are insulating layers.