Mode size converter for a planar waveguide

• US 20050183946A1
• Filed: 04/06/2005
• Published: 08/25/2005
• Est. Priority Date: 03/16/2002
• Status: Abandoned Application

• Current Assignee: Springworks, LLC (Petters Group Worldwide LLC)
• Original Assignee: Springworks, LLC (Petters Group Worldwide LLC)
• Inventors: Chen, Yu, Pan, Tao, Demaray, Richard E., Pethe, Rajiv, Xie, Yong Jin
• Application Number:
  US11/100,864
• Publication Number:
  US 20050183946A1
• Time in Patent Office: Days
• US Class Current: 204/192.260
• CPC Class Codes: C23C 14/044 using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
• CPC Class Codes: G02B 2006/12195 Tapering
• CPC Class Codes: G02B 6/1228 Tapered waveguides, e.g. integrated spot-size transformers for coupling with fibres G02B6/305
• CPC Class Codes: G02B 6/132 by deposition of thin films

Abstract

A process for forming a mode size converter with an out-of-plane taper formed during deposition with a shadow mask is disclosed. Mode-size converters according to the present invention can have any number of configurations. Measured coupling efficiencies for waveguides with mode size converters according to the present invention show marked improvement.

Claims

1. A method of forming a tapered waveguide, comprising:

depositing a core layer over a substrate with a shadow mask; and

patterning the core layer to form a tapered waveguide.

2. The method of claim 1, wherein depositing the core layer includes depositing an active core layer.

3. The method of claim 1, wherein depositing the core layer includes depositing a passive core layer.

4. The method of claim 1, further including depositing an uncercladding layer between the substrate and the core layer.

5. The method of claim 1, further including depositing another core layer between the core layer and the substrate.

6. The method of claim 1, wherein the shadow mask is positioned to adjust the taper of the tapered waveguide.

7. The method of claim 1, wherein depositing a core layer includes depositing a core layer with physical vapor deposition.

8. The method of claim 1, wherein depositing a core layer includes depositing a core layer by sputtering.