Polymer film metalization
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Abstract
Embodiments in accordance with the present invention eliminate the need for a subtractive metal patterning process to pattern the electrode above a ferroelectric polymer. Instead, a selective electroless deposition process is used. A conductive polymer is used as a seed layer for the electroless plating of the metal electrode. A cost saving is provided by eliminating the chemical costs associated with conventional resist removal processing. The methods also potentially eliminate the requirement for aggressive and environmentally unsafe chemical-based photoresist removal processes.
27 Citations
18 Claims
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1. (canceled)
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2. A method, comprising:
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forming a conductive polymer layer on a ferroelectric polymer layer;
patterning the conductive polymer; and
depositing a conductive layer on the patterned conductive polymer layer. - View Dependent Claims (3, 4, 5, 6, 7)
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8. A method for making a semiconductor substrate comprising:
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providing a substrate including a ferroelectric polymer layer;
forming a conductive polymer layer on the ferroelectric polymer layer;
patterning the conductive polymer layer; and
depositing a conductive layer on the patterned conductive polymer layer. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A method for making a semiconductor substrate comprising:
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providing a substrate including a patterned conductive polymer layer on top of the substrate; and
depositing a conductive layer on top of the patterned conductive polymer layer. - View Dependent Claims (15, 16, 17, 18)
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Specification