Probe tip processing

• US 20050184028A1
• Filed: 02/23/2005
• Published: 08/25/2005
• Est. Priority Date: 02/23/2004
• Status: Abandoned Application

• Current Assignee: Zyvex Instruments LLC (Thermo Fisher Scientific Incorporated)
• Original Assignee: Zyvex Corporation
• Inventors: Hartman, Adam, Stallcup, Richard E. II, Baur, Christof
• Application Number:
  US11/064,131
• Publication Number:
  US 20050184028A1
• Time in Patent Office: Days
• US Class Current: 216/92
• CPC Class Codes: G01N 1/28 Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Qmounting specimens on microscopic slides G02B21/34; means for supporting the objects or the materials to be analysed in electron microscopes H01J37/20 ; laboratory gas handling apparatus B01L5/00
• CPC Class Codes: G01N 1/32 Polishing; Etching
• CPC Class Codes: G01R 31/307 of integrated circuits
• CPC Class Codes: H01J 2237/20 Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
• CPC Class Codes: H01J 2237/2008 specially adapted for studying electrical or magnetical properties of objects
• CPC Class Codes: H01J 2237/206 Modifying objects while observing
• CPC Class Codes: H01J 2237/24592 Inspection and quality control of devices
• CPC Class Codes: H01J 2237/2594 Measuring electric fields or potentials
• CPC Class Codes: H01J 2237/28 Scanning microscopes
• CPC Class Codes: H01J 2237/2817 Pattern inspection
• CPC Class Codes: H01J 2237/31745 for preparing specimen to be viewed in microscopes or analyzed in microanalysers
• CPC Class Codes: H01J 37/3056 for microworking, e.g. etching of gratings, trimming of electrical components trimming of resistors H01C17/22

Abstract

A method including positioning a first probe tip of a first probe proximate a second probe tip of a second probe and heating at least one of the first and second probe tips such that a portion of probe material forming the at least one of the first and second probe tips dislodges to sharpen the at least one of the first and second probe tips.

Claims

1. A method, comprising:

positioning a first probe tip of a first probe proximate a second probe tip of a second probe; and

heating at least one of the first and second probe tips such that a portion of probe material forming the at least one of the first and second probe tips dislodges to sharpen the at least one of the first and second probe tips.

2. The method of claim 1 wherein positioning includes establishing direct physical contact between the first and second probe tips.

3. The method of claim 1 wherein the positioning includes positioning the first and second probe tips within a chamber of a charged particle beam device (CPBD).

4. The method of claim 1 wherein heating includes heating the first and second probe tips.

5. The method of claim 1 wherein heating includes heating the at least one of the first and second probe tips to a temperature ranging between about 600°

C. and about 4000°

C.

6. The method of claim 1 wherein heating includes heating by resistive heating.

7. The method of claim 1 wherein heating includes applying a voltage across the first and second probe tips, wherein the voltage ranges between about 1 volt and about 500 volts.

8. The method of claim 1 wherein heating includes introducing a current to the at least one of the first and second probe tips, wherein the current ranges between about 100 nanoamps and about 10 microamps.

9. The method of claim 1 wherein, in addition to sharpening the at least one of the first and second probe tips, the heating cleans the at least one of the first and second probe tips.

10. The method of claim 1 wherein heating includes:

heating the at least one of the first and second probe tips to an elevated temperature at which the probe material dislodges; and

maintaining the at least one of the first and second probe tips at the elevated temperature for a time period ranging between about 1 second and about 30 seconds.

11. The method of claim 1 wherein heating includes:

heating the at least one of the first and second probe tips to an elevated temperature at which the probe material dislodges; and

maintaining the at least one of the first and second probe tips at the elevated temperature for a time period less than about 1 second.

12. The method of claim 1 wherein a thinner one of the first and second probes is about 25% smaller in diameter relative to a thicker one of the first and second probes, and wherein the thinner one of the first and second probes includes the at least one of the first and second probe tips from which probe material dislodges during the heating.

13. The method of claim 1 wherein the at least one of the first and second probes tips has a substantially circular cross-section.

14. The method of claim 1 wherein, after the heating to sharpen, a tip apex of the at least one of the first and second probe tips has a radius of curvature that is less than about 10 nanometers.

15. The method of claim 1 wherein the at least one of the first and second probes substantially comprises tungsten.

16. A method, comprising:

contacting a first probe tip of a first probe and a second probe tip of a second probe, wherein the first probe substantially comprises metal;

heating the first and second probe tips to an elevated temperature at which a portion of the metal dislodges from the first probe tip; and

maintaining the first and second probe tips at the elevated temperature for a period of time to sharpen the first probe tip.

17. The method of claim 16 wherein the first probe substantially comprises tungsten and the period of time is selected to sharpen a tip apex of the first probe tip to a radius of curvature not greater than about 10 nanometers.

18. An apparatus, comprising:

means for positioning a first probe tip of a first probe proximate a second probe tip of a second probe within a chamber of a charged particle beam device; and

means for heating at least one of the first and second probe tips such that a portion of probe material forming the at least one of the first and second probe tips dislodges to sharpen the at least one of the first and second probe tips.

19. The apparatus of claim 18 wherein at least one of the positioning means and the heating means is at least partially automated.

20. The apparatus of claim 18 further comprising the charged particle beam device.