Large cavity wafer-level package for MEMS
First Claim
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1. A wafer-level package for a micromirror array, the wafer-level package comprising:
- a substrate comprising a wafer having a substrate surface;
a plurality of actuatable micromirrors coupled to the substrate surface; and
an optical window attached to the substrate surface to form at least one sealed cavity between an inner surface of the optical window and the substrate surface, wherein a beam of light transmitted through the optical window is redirected by at least one actuatable micromirror within the at least one sealed cavity.
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Abstract
The invention provides a wafer-level package for a micromirror array. The wafer-level package includes a substrate including a wafer having a substrate surface with a plurality of actuatable micromirrors coupled to the substrate surface. An optical window is attached to the substrate surface to form at least one sealed cavity between an inner surface of the optical window and the substrate surface. A beam of light transmitted through the optical window is redirected by at least one actuatable micromirror within the sealed cavity.
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Citations
40 Claims
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1. A wafer-level package for a micromirror array, the wafer-level package comprising:
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a substrate comprising a wafer having a substrate surface;
a plurality of actuatable micromirrors coupled to the substrate surface; and
an optical window attached to the substrate surface to form at least one sealed cavity between an inner surface of the optical window and the substrate surface, wherein a beam of light transmitted through the optical window is redirected by at least one actuatable micromirror within the at least one sealed cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A wafer-level package for a micromirror array, the wafer-level package comprising:
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a substrate comprising a wafer having a substrate surface;
a plurality of actuatable micromirrors coupled to the substrate surface; and
an optical window attached to the substrate surface to form a plurality of sealed cavities between an inner surface of the optical window and the substrate surface, wherein a beam of light transmitted through the optical window is redirected by at least one actuatable micromirror within one of the plurality of the sealed cavities.
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22. A method of packaging an array of actuatable micromirrors, the method comprising:
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providing a substrate comprising a wafer having a substrate surface and a plurality of actuatable micromirrors coupled to the substrate surface;
providing an optical window; and
attaching the optical window to the substrate surface to form at least one sealed cavity between an inner surface of the optical window and the substrate surface, wherein a beam of light transmitted through the optical window is redirected by at least one actuatable micromirror within the at least one sealed cavity. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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37. A micromirror assembly, the micromirror assembly comprising:
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a diced substrate having a substrate surface;
a plurality of actuatable micromirrors coupled to the substrate surface; and
an optical window attached to the substrate surface to form a sealed cavity between an inner surface of the optical window and the substrate surface, wherein the sealed cavity was formed prior to dicing of the substrate, wherein a beam of light transmitted through the optical window is redirected by at least one actuatable micromirror within the sealed cavity. - View Dependent Claims (38)
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39. A system, the system comprising:
a wafer-level package for a micromirror array, the wafer-level package including a substrate having a substrate surface, a plurality of actuatable micromirrors coupled to the substrate surface, and an optical window attached to the substrate surface to form a plurality of sealed cavities between an inner surface of the optical window and the substrate surface;
wherein a beam of light transmitted through the optical window is redirected by at least one actuatable micromirror within one of the plurality of sealed cavities.- View Dependent Claims (40)
Specification