LIGHT EMITTING DIODE WITH POROUS SIC SUBSTRATE AND METHOD FOR FABRICATING
First Claim
1. A light emitter, comprising:
- a substrate having a porous layer; and
a semiconductor emission region formed on said substrate, said emission region capable of emitting light omnidirectionally in response to a bias, said porous layer on one or more surfaces of said substrate not covered by said emission region, said porous layer enhancing extraction of said emission region light passing through said substrate.
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Accused Products
Abstract
A method and apparatus for forming a porous layer on the surface of a semiconductor material wherein an electrolyte is provided and is placed in contact with one or more surfaces of a layer of semiconductor material. The electrolyte is heated and a bias is introduced across said electrolyte and the semiconductor material causing a current to flow between the electrolyte and the semiconductor material. The current forms a porous layer on the one or more surfaces of the semiconductor material in contact with the electrolyte. The semiconductor material with its porous layer can serve as a substrate for a light emitter. A semiconductor emission region can be formed on the substrate. The emission region is capable of emitting light omnidirectionally in response to a bias, with the porous layer enhancing extraction of the emitting region light passing through the substrate.
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Citations
28 Claims
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1. A light emitter, comprising:
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a substrate having a porous layer; and
a semiconductor emission region formed on said substrate, said emission region capable of emitting light omnidirectionally in response to a bias, said porous layer on one or more surfaces of said substrate not covered by said emission region, said porous layer enhancing extraction of said emission region light passing through said substrate.
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3. A light emitter, comprising:
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a substrate having a porous layer; and
a semiconductor emission region formed on said substrate, said emission region capable of emitting light omnidirectionally in response to a bias, said porous layer enhancing extraction of said emission region light passing through said substrate, wherein said porous layer is on the surface of said substrate opposite said emission region. - View Dependent Claims (2, 4, 5, 6, 11)
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7. A light emitter, comprising:
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a substrate having a porous layer; and
a semiconductor emission region formed on said substrate, said emission region capable of emitting light omnidirectionally in response to a bias, said porous layer enhancing extraction of said emission region light passing through said substrate, wherein said emission region is formed on a surface of said substrate, the surface of said substrate opposite said emission region being patterned, said porous layer on said patterned surface of said substrate. - View Dependent Claims (8, 9, 10)
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12. An apparatus for forming a porous layer on the surface of a semiconductor, comprising:
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an electrolyte held in a reservoir, said reservoir arranged to allow said electrolyte to contact one or more surfaces of a layer of semiconductor material;
a heater for heating said electrolyte; and
a power source for applying a bias across said electrolyte and said layer of semiconductor material, said bias causing a current to run between said electrolyte and said layer of semiconductor material forming a porous layer on said one or more surfaces of said semiconductor material in contact with said electrolyte. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A method for forming a porous layer on the surface of a semiconductor, comprising:
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providing an electrolyte;
placing said electrolyte in contact with one or more surfaces of a layer of semiconductor material;
heating said electrolyte;
introducing a bias across said electrolyte and said semiconductor material causing a current to flow between said electrolyte to said semiconductor material, forming a porous layer on said one or more surfaces of said semiconductor in contact with said electrolyte. - View Dependent Claims (23, 24)
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25. A light emitting diode (LED) package, comprising:
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an LED comprising;
a substrate with a porous layer on one surface;
an emission region formed on said substrate on a surface opposite said porous layer;
one or more metal layers, said LED flip-chip mounted to said metal layers with said substrate being the primary emission surface of said LED; and
two contacts for applying a bias across said emission region causing said emission region to emit light omnidirectionally, said porous layer enhancing light extraction of emission region light passing through said substrate. - View Dependent Claims (26, 27)
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28. (canceled)
Specification