Optical semiconductor device and electronic equipment using same
First Claim
1. An optical semiconductor device comprising:
- a lead frame having an aperture;
a submount having transparency which is disposed on one surface of the lead frame to close the aperture of the lead frame;
a semiconductor optical element which has an optical portion and which is mounted on a surface of the submount opposite to a surface on a side of the aperture of the lead frame with the optical portion facing the aperture through the submount;
a molding portion made of a non-transparent molding resin which exposes at least a region including the aperture on the other surface side of the lead frame and which encapsulates the lead frame, the semiconductor optical element and the submount; and
a lens disposed on the other surface of the lead frame to close the aperture of the lead frame.
1 Assignment
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Accused Products
Abstract
An optical semiconductor device 1a includes a lead frame 4 having an aperture 7, a submount 8 disposed on one surface of the lead frame 4 to close the aperture 7, a semiconductor optical element 3 which has an optical portion 6 and which is mounted on a surface of the submount 8 opposite to a surface on a side of the aperture 7 with the optical portion 6 facing the aperture 7 through the submount 8, a molding portion 10 made of a non-transparent molding resin which exposes at least a region including the aperture 7 on the other surface side of the lead frame 4 and which encapsulates the lead frame 4, the semiconductor optical element 3 and the submount 8, and a lens 9 disposed on the other surface of the lead frame 4 to close the aperture 7.
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Citations
24 Claims
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1. An optical semiconductor device comprising:
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a lead frame having an aperture;
a submount having transparency which is disposed on one surface of the lead frame to close the aperture of the lead frame;
a semiconductor optical element which has an optical portion and which is mounted on a surface of the submount opposite to a surface on a side of the aperture of the lead frame with the optical portion facing the aperture through the submount;
a molding portion made of a non-transparent molding resin which exposes at least a region including the aperture on the other surface side of the lead frame and which encapsulates the lead frame, the semiconductor optical element and the submount; and
a lens disposed on the other surface of the lead frame to close the aperture of the lead frame. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification