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System in package

  • US 20050184376A1
  • Filed: 02/19/2004
  • Published: 08/25/2005
  • Est. Priority Date: 02/19/2004
  • Status: Abandoned Application
First Claim
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1. A circuit board for a stacked package comprising:

  • an electrically conductive substrate having a plurality of foldable tabs or delineated surfaces; and

    , a multi-layer interconnection circuit having conductive traces fabricated on one or both sides of said substrate, and one or more attachment sites on one or more of said tabs or delineated surfaces, said attachment sites having terminals for connection to selected traces in said interconnection circuit.

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