System in package
First Claim
1. A circuit board for a stacked package comprising:
- an electrically conductive substrate having a plurality of foldable tabs or delineated surfaces; and
, a multi-layer interconnection circuit having conductive traces fabricated on one or both sides of said substrate, and one or more attachment sites on one or more of said tabs or delineated surfaces, said attachment sites having terminals for connection to selected traces in said interconnection circuit.
2 Assignments
0 Petitions
Accused Products
Abstract
A system in package (SIP) is fabricated on a sheet of copper foil. An interconnection circuit is fabricated on the foil using copper conductors and a dual damascene structure for each conductive layer. The preferred dielectric material is an amorphous fluorinated polymer called Cytop. Input/output traces of the interconnection circuit terminate in wells filled with solder. Chips are bumped and direct attached by inserting the bumps into the wells. The preferred bumps are gold stud bumps, and the preferred wells contain solder paste to a depth of approximately 15 microns. Imprinting is the preferred method for patterning; it enables 6-micron wide traces, 6-micron diameter vias, and a cost per well of around 0.02 cents. Stripline structures are described for a 4-layer stackup that can support operating frequencies of at least 10 GHz. New methods are proposed for testing the completed assembly and for rework of any chips that prove defective. After the assembly is fully tested and reworked in sheet form the copper foil is folded to form a stacked die package or system in package. 5-high and 9-high stacks are illustrated. The copper foil provides a low impedance thermal path for cooling every chip in the SIP.
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Citations
35 Claims
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1. A circuit board for a stacked package comprising:
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an electrically conductive substrate having a plurality of foldable tabs or delineated surfaces; and
,a multi-layer interconnection circuit having conductive traces fabricated on one or both sides of said substrate, and one or more attachment sites on one or more of said tabs or delineated surfaces, said attachment sites having terminals for connection to selected traces in said interconnection circuit. - View Dependent Claims (3, 4, 6, 7, 8, 9, 10, 11, 12)
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2. A circuit board comprising:
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an electrically conductive substrate;
a multi-layer interconnection circuit having conductive traces fabricated on one or both sides of said substrate, and one or more attachment sites which include a plurality of attachment terminals with each of said terminals adapted to connect with selected traces of said interconnection circuit, wherein each of said terminals is either a bump or a well filled with solder. - View Dependent Claims (5)
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13. A high density cable comprising:
an electrically conductive substrate;
a multi-layer interconnection circuit having conductive traces fabricated on said substrate and at least two attachment sites wherein each of said attachment sites includes a plurality of attachment terminals and each of said terminals connects with a selected trace of said interconnection circuit.- View Dependent Claims (14, 15, 16, 17, 18)
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19. A stacked microelectronic assembly comprising:
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an electrically conductive substrate having a plurality of foldable tabs or delineated surfaces;
a multi-layer interconnection circuit having conductive traces fabricated on one or both sides of said conductive substrate and one or more attachment sites on one or more of said tabs or delineated surfaces, said attachment sites having terminals for connection to selected traces in said interconnection circuit;
a plurality of microelectronic elements attached at said attachment sites using said attachment terminals; and
,wherein at least one of said foldable tabs or delineated surfaces is folded to form a stacked arrangement of said folded tabs or delineated surfaces. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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34. A method for fabricating a stacked microelectronic assembly comprising the steps of:
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a) providing an electrically conductive substrate;
b) providing a plurality of delineated surfaces-in the plane of said conductive substrate;
c) fabricating a multi-layer interconnection circuit having conductive traces on said delineated surfaces;
d) providing one or more attachment sites on at least one of said delineated surfaces, each of said attachment sites including a plurality of attachment terminals, wherein each of said terminals may connect with a selected trace of said interconnection circuit;
e) attaching a plurality of microelectronic elements at said attachment sites using said attachment terminals;
f) providing a means to test said microelectronic elements by using a test chip at-one of said attachment sites, or by using a cable connecting between one of said attachment sites and an external tester;
g) testing said microelectronic assembly using said test means and replacing any of said microelectronic elements that prove defective;
h) dicing said conductive substrate to separate said microelectronic assemblies if more than one of said assemblies is provided on said conductive substrate; and
,i) folding one or more of said delineated surfaces to form a stack of said delineated surfaces, for each of said microelectronic assemblies.
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35. A rugged microelectronic assembly comprising:
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a base substrate of copper;
an interconnection circuit fabricated on said base substrate;
one or more microelectronic assemblies attached to said interconnection circuit; and
,a top member of copper that is machined to accommodate any height variation in said assemblies.
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Specification