Method to determine the value of process parameters based on scatterometry data

• US 20050185174A1
• Filed: 05/26/2004
• Published: 08/25/2005
• Est. Priority Date: 02/23/2004
• Status: Abandoned Application

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Carpaij, Rene Hubert Jacobus, Cramer, Hugo Augustinus Joseph, Kiers, Antoine Gaston Marie, Laan, Hans Van Der
• Application Number:
  US10/853,724
• Publication Number:
  US 20050185174A1
• Time in Patent Office: Days
• US Class Current: 356/243.100
• CPC Class Codes: G01N 2021/95615 with stored comparision signal
• CPC Class Codes: G01N 21/274 Calibration, base line adjustment, drift correction
• CPC Class Codes: G01N 21/278 Constitution of standards
• CPC Class Codes: G01N 21/47 Scattering, i.e. diffuse reflection G01N21/25, G01N21/41 take precedence G01N21/55 takes precedence
• CPC Class Codes: G01N 21/4785 Standardising light scatter apparatus; Standards therefor
• CPC Class Codes: G01N 21/4788 Diffraction for sizing particles G01N15/0205
• CPC Class Codes: G01N 21/9501 Semiconductor wafers manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G01N 21/95607 using a comparative method
• CPC Class Codes: G03F 7/705 Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
• CPC Class Codes: G03F 7/70508 Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
• CPC Class Codes: G03F 7/70516 Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
• CPC Class Codes: G03F 7/70625 Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
• CPC Class Codes: G03F 7/70633 Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
• CPC Class Codes: G03F 7/70641 Focus
• CPC Class Codes: G03F 7/70683 Mark designs

Abstract

A method according to an embodiment includes obtaining calibration measurement data, with an optical detection apparatus, from a plurality of marker structure sets provided on a calibration substrate. Each marker structure set includes at least one calibration marker structure created using different known values of the process parameter. The method includes obtaining measurement data, with the optical detection apparatus, from at least one marker structure provided on a substrate and exposed using an unknown value of the process parameter; and determining the unknown value of the process parameter from the obtained measurement data by employing regression coefficients in a model based on the known values of the process parameter and the calibration measurement data.

Claims

1. A method for determining at least one process parameter related to a lithographic apparatus, the method comprising:

obtaining calibration measurement data, with an optical detection apparatus, from a plurality of marker structure sets provided on a calibration substrate, each of said plurality of marker structure sets including at least one calibration marker structure created using different known values of said at least one process parameter;

determining a mathematical model by using said known values of said at least one process parameter and by employing a regression technique on said calibration measurement data, said mathematical model comprising a number of regression coefficients;

obtaining measurement data, with said optical detection apparatus, from at least one marker structure provided on a substrate, said at least one marker structure being exposed with an unknown value of said at least one process parameter; and

determining the unknown value of said at least one process parameter for said substrate from said obtained measurement data by employing said regression coefficients of said mathematical model.

2. A method according to claim 1, wherein said optical detection apparatus is a scatterometer.

3. A method according to claim 1, wherein said at least one process parameter is selected from a group consisting of focus, exposure dose, overlay error, track parameters related to dose, variation of line width over reticle, variations from reticle-to-reticle, projection lens aberrations, projection lens flare, and angular distribution of light illuminating the reticle.

4. A method according to claim 1, wherein the regression technique used by the mathematical model is selected from a group consisting of principal component regression, non-linear principal component regression, partial least squares modeling and non-linear partial least squares modeling.

5. A method according to claim 1, wherein the substrate comprises one of the group consisting of a test wafer and a product wafer.

6. A method according to claim 5, wherein the at least one marker structure is positioned on said substrate within one of the group consisting of a chip area and a scribe-lane.

7. A method according to claim 5, wherein the at least one marker structure is a part of a device pattern within a chip area.

8. A method according to claim 1, wherein the at least one marker structure comprises a diffraction grating.

9. A method according to claim 1, wherein the method further comprises preprocessing the obtained calibration measurement data and the obtained measurement data before said employing said regression coefficients.

10. A method according to claim 9, wherein said preprocessing includes performing on said data at least one of the group of mathematical operations consisting of subtraction of a mean, division by standard deviation, selection of optical parameters and weighing of optical parameters, and

wherein the optical parameters include at least one of the group of parameters consisting of wavelength, angle and polarization state.

11. A method according to claim 1, wherein the lithographic apparatus comprises:

an illumination system configured to provide a beam of radiation;

a support structure configured to support a patterning structure, the patterning structure serving to impart the beam of radiation with a pattern in its cross-section;

a substrate table configured to hold the substrate; and

a projection system configured to project the patterned beam onto a target portion of the substrate.

12. A semiconductor device produced with the method according to claim 1.

13. A system for determining at least one process parameter related to a lithographic apparatus, the system comprising:

an optical detection apparatus configured to provide measurement data related to said at least one process parameter; and

a processor unit comprising a mathematical model defining how said at least one process parameter can be derived from said measurement data,

wherein said optical detection apparatus is further configured to;

obtain calibration data from a plurality of marker structure sets provided on a calibration substrate, each of said plurality of marker structure sets comprising at least one calibration marker structure created using different known values of said at least one process parameter;

provide said calibration data to said processor unit;

obtain measurement data on at least one marker structure provided on a substrate, said at least one marker structure being made using an unknown value of said at least one process parameter to be determined; and

provide said measurement data to said processor unit;

and wherein said processor unit is further configured to;

determine said mathematical model by using said known values of said at least one parameter and by employing a regression technique on said calibration data, received from said optical detection apparatus, said mathematical model comprising a number of regression coefficients; and

determine the unknown value of said at least one process parameter for said substrate from said obtained measurement data, received from said optical detection apparatus, by employing said regression coefficients in said mathematical model.

14. A system according to claim 13, wherein said optical detection apparatus is a scatterometer.

15. A system according to claim 13, wherein said at least one process parameter is selected from the group consisting of focus, exposure dose, overlay errors, track parameters related to dose, variation of line width over a reticle, variations from reticle-to-reticle, projection lens aberrations, projection lens flare, and angular distribution of light illuminating the reticle.

16. A system according to claim 13, wherein the regression technique used by the mathematical model is selected from the group consisting of principal component regression, non-linear principal component regression, partial least squares modeling and non-linear partial least squares modeling.

17. A system according to claim 13, wherein at least one of the substrate and the calibration substrate comprises at least two different marker structures.

18. A system according to claim 17, wherein said at least two marker structures are in close proximity to each other, such that a distance between the at least two marker structures is in the same order of magnitude as a size of the at least two marker structures.

19. A system according to claim 17, wherein said at least two marker structures comprise a first marker structure comprising a number of non-patterned layers and a second marker structure comprising the same non-patterned layers on top of which a pattern is provided.

20. A system according to claim 17, wherein said at least two marker structures comprise a first marker structure comprising a pattern with isolated lines and a second marker structure comprising a pattern having at least one of the group consisting of dense lines and isolated spaces.

21. A system according to claim 13, further comprising a lithographic apparatus comprising:

an illumination system configured to provide a projection beam of radiation;

a support structure configured to support a patterning structure, the patterning structure serving to impart the projection beam with a pattern in its cross-section;

a substrate table configured to hold a substrate with at least one marker structure; and

a projection system configured to project the patterned beam onto a target portion of the substrate.

22. A system according to claim 21, wherein the lithographic apparatus is connected to a track, and the optical detection apparatus is connected to the same track as the lithographic apparatus.

23. A semiconductor device produced with the system of claim 21.

24. A method for determining at least one process parameter related to a lithographic apparatus, the method comprising:

obtaining calibration data, with an optical detection apparatus, from at least two calibration marker structures provided on a calibration substrate, at least one of said at least two calibration marker structures being created using multiple known values of said at least one process parameter;

preprocessing said calibration data by performing at least one mathematical operation upon said calibration data;

determining a mathematical model by using said known values of said at least one parameter and by employing a regression technique on said preprocessed calibration data, said mathematical model comprising a number of regression coefficients;

obtaining measurement data, with said optical detection apparatus, from at least one measurement marker provided on a substrate, said at least one measurement marker being created using an unknown value of said at least one process parameter; and

determining the unknown value of said at least one process parameter for said substrate from said measurement data by preprocessing said measurement data, said preprocessing including performing said at least one mathematical operation, and employing said regression coefficients of said mathematical model.

25. A method according to claim 24, wherein said at least two calibration marker structures comprises a first calibration marker structure comprising a number of non-patterned layers and a second calibration marker structure comprising the same non-patterned layers on top of which a pattern is provided.

26. A method according to claim 24, wherein said calibration data and measurement data comprise spectral data.

27. A method according to claim 26, wherein said at least one mathematical operation includes at least one of a group of mathematical operations comprising subtraction of a mean, division by standard deviation, selection of optical parameters and weighing of optical parameters, wherein the optical parameters comprise at least one of a group of parameters comprising wavelength, angle and polarization state.

28. A method according to claim 24, wherein said at least two calibration marker structures comprises a first calibration marker structure comprising a pattern with isolated lines and a second calibration marker structure comprising a pattern with dense lines or isolated spaces.

29. A system for determining at least one process parameter related to a lithographic apparatus, the system comprising:

an optical detection apparatus configured to provide measurement data related to said at least one process parameter; and

a processor unit comprising a mathematical model defining how said at least one process parameter can be derived from said measurement data,

wherein said optical detection apparatus is configured to;

obtain calibration data from at least two different calibration marker structures provided on a calibration substrate, at least one of said at least two calibration marker structures being created using multiple known values of said at least one process parameter;

provide said calibration data to said processor unit;

obtain measurement data on at least one marker structure provided on a substrate, exposed with an unknown value of said at least one process parameter to be determined; and

provide said measurement data to said processor unit;

and wherein said processor unit is configured to;

preprocess said calibration data by performing at least one mathematical operation upon the calibration data obtained on said at least two different calibration marker structures;

determine said mathematical model by using said known values of said at least one parameter and by employing a regression technique on said preprocessed calibration data, said mathematical model comprising a number of regression coefficients; and

determine the unknown value of said at least one process parameter for said substrate from said measurement data, by preprocessing said measurement data by performing said at least one mathematical operation and employing said regression coefficients in said mathematical model.

30. A system according to claim 29, wherein said at least two calibration marker structures comprises a first calibration marker structure comprising a number of non-patterned layers and a second calibration marker structure comprising the same non-patterned layers on top of which a pattern is provided.

31. A system according to claim 30, wherein said at least two calibration marker structures comprises a first calibration marker structure comprising a pattern with isolated lines and a second calibration marker structure comprising a pattern having one of the group consisting of dense lines and isolated spaces.

32. A system comprising according to claim 30, said system comprising a lithographic apparatus comprising:

an illumination system configured to provide a beam of radiation;

a support structure configured to support a patterning structure, the patterning structure serving to impart the beam of radiation with a pattern in its cross-section;

a substrate table configured to hold a substrate with at least one marker structure; and

a projection system configured to project the patterned beam onto a target portion of the substrate.

33. A semiconductor device produced with the system according to claim 32.

34. A method for determining at least one parameter of a lithographic apparatus, the method comprising:

measuring a plurality of calibration spectra obtained from a plurality of calibration structures, each of the plurality of calibration structures being created using a different known value of said at least one parameter;

performing a regression analysis on said plurality of calibration spectra to determine a mathematical model that defines a relationship between a spectrum and a value of said at least one parameter;

measuring a spectrum obtained with a marker structure provided on a substrate, said marker structure being exposed with said lithographic apparatus using an unknown value of said at least one parameter; and

determining said unknown value of said at least one parameter using said mathematical model.

35. A method according to claim 34, further comprising pre-processing said plurality of calibration spectra before performing the regression analysis.

36. A method according to claim 34, wherein said plurality of calibration structures and said marker structure have substantially comparable shapes.