Metallic structures incorporating bioactive materials and methods for creating the same

• US 20050186250A1
• Filed: 03/24/2005
• Published: 08/25/2005
• Est. Priority Date: 09/19/2001
• Status: Abandoned Application

• Current Assignee: Medlogics Device Corporation
• Original Assignee: Medlogics Device Corporation
• Inventors: Gertner, Michael E., Schlesinger, Mordechay
• Application Number:
  US11/090,998
• Publication Number:
  US 20050186250A1
• Time in Patent Office: Days
• US Class Current: 424/423
• CPC Class Codes: A61F 2/82 Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents stent-grafts for tubular structures of the body other than blood vessels A61F2/04; stent-grafts for blood vessels A61F2/07; instruments specially adapted for placement or removal of stents or stent-grafts A61F2/95; for closing wounds, or holding wounds closed A61B17/04 - A61B17/115; dilators A61M29/00
• CPC Class Codes: A61F 2250/0067 Means for introducing or releasing pharmaceutical products into the body
• CPC Class Codes: A61L 2300/416 Anti-neoplastic or anti-proliferative or anti-restenosis or anti-angiogenic agents, e.g. paclitaxel, sirolimus
• CPC Class Codes: A61L 2300/434 of enzymes
• CPC Class Codes: A61L 2300/606 Coatings
• CPC Class Codes: A61L 27/30 Inorganic materials
• CPC Class Codes: A61L 27/42 having an inorganic matrix
• CPC Class Codes: A61L 27/54 Biologically active materials, e.g. therapeutic substances A61L27/227 takes precedence
• CPC Class Codes: A61L 31/082 Inorganic materials
• CPC Class Codes: A61L 31/088 Other specific inorganic materials not covered by A61L31/084 or A61L31/086
• CPC Class Codes: A61L 31/121 having an inorganic matrix
• CPC Class Codes: A61L 31/146 Porous materials, e.g. foams or sponges
• CPC Class Codes: A61L 31/16 Biologically active materials, e.g. therapeutic substances A61L31/047 takes precedence
• CPC Class Codes: A61P 11/06 Antiasthmatics
• CPC Class Codes: A61P 19/10 for osteoporosis
• CPC Class Codes: A61P 25/08 Antiepileptics; Anticonvulsants
• CPC Class Codes: A61P 25/16 Anti-Parkinson drugs
• CPC Class Codes: A61P 25/18 Antipsychotics, i.e. neuroleptics; Drugs for mania or schizophrenia
• CPC Class Codes: A61P 25/24 Antidepressants
• CPC Class Codes: A61P 29/00 Non-central analgesic, antipyretic or antiinflammatory agents, e.g. antirheumatic agents; Non-steroidal antiinflammatory drugs [NSAID]
• CPC Class Codes: A61P 3/10 : for hyperglycaemia, e.g. antidiabetics
• CPC Class Codes: A61P 31/00 : Antiinfectives, i.e. antibiotics, antiseptics, chemotherapeutics
• CPC Class Codes: A61P 35/00 : Antineoplastic agents
• CPC Class Codes: A61P 43/00 : Drugs for specific purposes, not provided for in groups A61P1/00-A61P41/00
• CPC Class Codes: A61P 7/02 : Antithrombotic agents; Anticoagulants; Platelet aggregation inhibitors
• CPC Class Codes: A61P 9/00 : Drugs for disorders of the cardiovascular system
• CPC Class Codes: B82Y 30/00 : Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: C23C 18/165 : Multilayered product layered product B32B
• CPC Class Codes: C23C 18/1657 : Electroless forming, i.e. substrate removed or destroyed at the end of the process
• CPC Class Codes: C23C 18/1662 : Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
• CPC Class Codes: C23C 18/1831 : Use of metal, e.g. activation, sensitisation with noble metals
• CPC Class Codes: C25D 15/00 : Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
• CPC Class Codes: C25D 5/022 : using masking means
• CPC Class Codes: C25D 5/48 : After-treatment of electroplated surfaces
• CPC Class Codes: C25D 5/617 : Crystalline layers
• CPC Class Codes: C25D 5/619 : Amorphous layers
• CPC Class Codes: C25D 5/623 : Porosity of the layers

Abstract

One embodiment of the invention is directed to a method comprising providing an electrochemical solution comprising metal ions and a bioactive material such as bioactive molecules, and then contacting the electrochemical solution and a substrate. A bioactive composite structure is formed on the substrate using an electrochemical process, where the bioactive composite structure includes a metal matrix and the bioactive material within the metal matrix.

Claims

1. A process for forming a bioactive material delivery device comprising the steps of:

providing a substrate; and

electroplating onto said substrate a porous layer having voids.

2. The process of claim 1, wherein said electroplating step comprises electroplating a material that is substantially free of the bioactive material to be delivered.

3. The process of claim 2, wherein the bioactive material is one or more drugs.

4. The process of claim 3, further comprising after said electroplating step, the step of loading said one or more drugs into said voids.

5. The process of claim 4, wherein after the step of loading one or drugs into said voids, further comprising the step of forming a topcoat over said drug loaded layer.

6. The process of claim 5, wherein said step of forming a topcoat comprises applying a polymer over said drug loaded layer.

7. The process of claim 1, wherein one of the conditions for controlling the deposition of the porous layer onto the substrate is by control of current density during the electroplating step.

8. The process of claim 1, wherein said bioactive material delivery device is a stent.

9. The process of claim 1, wherein said electroplating step comprises electroplating a metal selected from the group consisting of gold, nickel, silver, copper, palladium, platinum, cobalt, chromium, iron, and alloys thereof.

10. The process of claim 1, wherein between said step of providing a substrate and said step of electroplating said porous layer, further comprising the step of electroplating a solid layer onto said substrate.

11. The process of claim 1, further comprising the step of forming a topcoat over said porous layer.

12. The process of claim 11, wherein said step of forming a topcoat comprises applying a polymer over said porous layer.

13. The process of claim 1, wherein the bioactive material to be delivered is co-deposited during the electroplating step.

14. The process of claim 1, wherein said voids have an average void size of less than about 1 micron.

15. The process of claim 14, wherein said average void size is less than about 10 nanometers.

16. A process for forming drug delivery stent comprising:

providing a mandrel;

coating said mandrel with a resist;

exposing portions of said resist to a light pattern so as to form a stent pattern on said mandrel in said resist;

electroplating a stent on said mandrel;

electroplating a porous layer having voids on said stent; and

removing said resist and said mandrel.

17. The process of claim 16, wherein said electroplating step comprises electroplating a material that is substantially free of the drug to be delivered.

18. The process of claim 17, further comprising controlling current density during the electroplating step.

19. A process for forming a drug delivery stent comprising:

providing a prefabricated stent; and

electroplating a porous layer having voids on said stent.

20. The process of claim 19, wherein said electroplating step comprises electroplating a material that is substantially free of the drug to be delivered.

21. The process of claim 20, further comprising controlling current density during the electroplating step.