Method of forming thin film patterning substrate including formation of banks

• US 20050186403A1
• Filed: 03/31/2005
• Published: 08/25/2005
• Est. Priority Date: 03/17/1998
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Kiguchi, Hiroshi, Seki, Shunichi, Miyajima, Hiroo, Yudasaka, Ichio
• Granted Patent: US 7,442,955 B2
• Time in Patent Office: Days
• US Class Current: 428/195.100
• CPC Class Codes: G02B 5/201 in the form of arrays
• CPC Class Codes: H05B 33/10 Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• CPC Class Codes: H05B 33/22 characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
• CPC Class Codes: H10K 2102/351 Thickness
• CPC Class Codes: H10K 50/865 comprising light absorbing layers, e.g. light-blocking layers
• CPC Class Codes: H10K 59/122 Pixel-defining structures or layers, e.g. banks
• CPC Class Codes: H10K 59/38 comprising colour filters or colour changing media [CCM]
• CPC Class Codes: H10K 59/8792 comprising light absorbing layers, e.g. black layers
• CPC Class Codes: H10K 71/135 using ink-jet printing
• CPC Class Codes: H10K 71/20 Changing the shape of the active layer in the devices, e.g. patterning
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Abstract

Display devices such as EL elements or LED elements, are formed from thin film elements having banks of prescribed height and a thin film layer formed by an ink jet method in areas to be coated that are partitioned by those banks. The banks may be formed of an organic material on a bank formation surface configured of an inorganic material, plasma treatment is performed under conditions that the induction gas is fluorine-based and that fluorine is present excessively, and the areas enclosed by the banks subjected to surface treatment are filled with the liquid thin film material to form the thin film layer or layers.

Claims

1. A thin film patterning substrate, used for forming thin films in patterns by a dip process or spin-coating process, comprising:

a surface on which are formed banks and areas to be coated, partitioned by said banks,

said banks including surfaces formed of an organic substance, and said areas to be coated formed of an inorganic substance.

5. The thin film patterning substrate according to claim 1, wherein the thin film patterning substrate is treated by a surface treatment such that an angle of contact of the organic substance surface forming said banks is 50°

or greater, an angle of contact with the inorganic substance forming said banks is 20°

to 50°

, and an angle of contact of surfaces of said areas to be coated with said thin film liquid material is 30°

or less.

6. The thin film patterning substrate according to claim 5, said surface treatment being effected by plasma treatment.

2. A thin film patterning substrate, used for forming thin films in patterns by a dip process or spin-coating process, comprising:

a surface on which are formed banks and areas to be coated, partitioned by said banks,

said banks including upper surfaces and side surfaces formed of an organic substance, and said areas to be coated formed of an inorganic substance.

3. A thin film patterning substrate, used for forming thin films in patterns by a dip process or spin-coating process, comprising:

a surface on which banks and areas to be coated are formed, partitioned by said banks;

said banks being formed in two layers including a lower-layer inorganic substance and an upper-layer organic substance, and said areas to be coated being formed of an inorganic substance.

4. The thin film patterning substrate according to claim 3, wherein said banks include side surfaces of a lower layer which are not covered by said organic substance.