Wiring substrate produced by transfer material method

• US 20050186768A1
• Filed: 03/25/2005
• Published: 08/25/2005
• Est. Priority Date: 02/09/2000
• Status: Active Grant

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Sugaya, Yasuhiro, Matsuoka, Yasuyuki, Komatsu, Shingo, Nakatani, Seiichi, Hirano, Koichi, Asahi, Toshiyuki, Yamashita, Yoshihisa
• Granted Patent: US 7,888,789 B2
• Time in Patent Office: Days
• US Class Current: 438/597
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2203/1461 Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
• CPC Class Codes: H05K 3/20 by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/205 using a pattern electroplated or electroformed on a metallic carrier
• CPC Class Codes: H05K 3/4061 for via connections in inorganic insulating substrates
• CPC Class Codes: H05K 3/4069 for via connections in organic insulating substrates
• CPC Class Codes: Y10T 29/49149 by metal fusion bonding
• CPC Class Codes: Y10T 29/49179 by metal fusion bonding
• CPC Class Codes: Y10T 29/49208 by assembling plural parts
• CPC Class Codes: Y10T 29/49213 : Metal
• CPC Class Codes: Y10T 428/12486 : Laterally noncoextensive components [e.g., embedded, etc.]

Abstract

A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

Claims

1-21. -21. (canceled)

22. A transfer material comprising at least two layers of

a first metal layer as a carrier, and

a second metal layer as a wiring pattern,

wherein a circuit component is formed on the first metal layer by a printing method for electrically connecting to the second metal layer.

23. The transfer material according to claim 22, wherein a peel layer is formed between the first metal layer and the second metal layer, and adheres the first metal layer to the second metal layer releasably.

24. The transfer material according to claim 23, wherein a thickness of the peel layer is 1 μ

m or less.

25. The transfer material according to claim 23, wherein the peel layer is an organic layer or a metal plating layer.

26. The transfer material according to claim 25, wherein the peel layer is an Au plating layer.

27. The transfer material according to claim 23, wherein an adhesive strength between the first metal layer and the second metal layer via the peel layer is 10 N/m or more and 50 N/m or less.

28. The transfer material according to claim 22, wherein the circuit component comprises at least one component selected from the group consisting of an inductor, a capacitor and a resistor.

29. The transfer material according to claim 22, wherein the circuit component is formed of a material comprising an inorganic filler and a resin composition.

30. The transfer material according to claim 22, wherein the circuit component is formed of a material comprising an inorganic filler, an organic binder and a plasticizer.

31. The transfer material according to claim 22, wherein a thickness of the first metal layer is 4 to 100 μ

m, and a thickness of the second metal layer and the circuit component is 1 to 35 μ

m.

32. The transfer material according to claim 22, wherein a convex and concave portion is formed on the surface portion of the first metal layer,

the convex portion corresponds to the wiring pattern of the second metal layer, and

an upper layer on the first metal layer is formed on the convex portion.

33. The transfer material according to claim 32, wherein a height of the convex portion in the first metal layer is 1 to 12 μ

m.

34. The transfer material according to claim 22, wherein each of the first metal layer and the second metal layer comprises at least one metal selected from the group consisting of copper, aluminum, silver, and nickel.

35. The transfer material according to claim 22, wherein the first metal layer and the second metal layer comprise the same metal component.

36-123. -123. (canceled)