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Through-hole conductors for semiconductor substrates and method and system for making same

  • US 20050186791A1
  • Filed: 02/23/2004
  • Published: 08/25/2005
  • Est. Priority Date: 02/23/2004
  • Status: Active Grant
First Claim
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1. A method for electrically coupling a first side of a semiconductor substrate to a second side of said semiconductor substrate, comprising:

  • forming a hole having an inner surface from a first side of a semiconductor substrate to a second side of said semiconductor substrate; and

    plating said inner surface of said semiconductor substrate to form a plated conductive element by forcing a plating solution from said first side of said semiconductor substrate to said second side of said semiconductor substrate through said hole.

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