Through-hole conductors for semiconductor substrates and method and system for making same
First Claim
1. A method for electrically coupling a first side of a semiconductor substrate to a second side of said semiconductor substrate, comprising:
- forming a hole having an inner surface from a first side of a semiconductor substrate to a second side of said semiconductor substrate; and
plating said inner surface of said semiconductor substrate to form a plated conductive element by forcing a plating solution from said first side of said semiconductor substrate to said second side of said semiconductor substrate through said hole.
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Accused Products
Abstract
A method, structure and system for forming a through-hole conductor in a substrate includes forming a hole having an inner surface from a first side of the semiconductor substrate to a second side of the semiconductor substrate and plating the inner surface of the semiconductor substrate to form a conductive element when a plating solution is forced from the first side of the semiconductor substrate to the second side of the semiconductor substrate through the hole. The hole is plated in a generally planar plating topology from the first side to the second side of the semiconductor wafer. The through-hole conductor may be formed in a plating system where the semiconductor substrate forms at least a partial partition between a higher pressure bath and a lower pressure bath with the plating solution passing through the hole causing plating within the inner surface of the hole.
49 Citations
20 Claims
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1. A method for electrically coupling a first side of a semiconductor substrate to a second side of said semiconductor substrate, comprising:
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forming a hole having an inner surface from a first side of a semiconductor substrate to a second side of said semiconductor substrate; and
plating said inner surface of said semiconductor substrate to form a plated conductive element by forcing a plating solution from said first side of said semiconductor substrate to said second side of said semiconductor substrate through said hole. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of making a contactor card comprising:
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forming a hole completely through a semiconductor substrate from a first side to a second side of said semiconductor substrate with an inner surface formed thereby; and
forcing a plating solution through said hole from a first plating bath to a second plating bath to deposit conductive material on said inner surface to form a first plated conductive element extending from said first side to said second side. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. A semiconductor substrate plating system, comprising:
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a first plating fixture configured to receive a first semiconductor substrate including first and second sides and having at least one hole having an inner surface from said first side of said first semiconductor substrate to said second side of said first semiconductor substrate; and
a plating tank configured to receive said first plating fixture with said first semiconductor substrate therein, said first plating fixture and said first semiconductor substrate forming a partition within said plating tank of a higher pressure side with a higher pressure bath and a lower pressure side with a lower pressure bath with plating solution passing through said at least one hole from said higher pressure bath to said lower pressure bath and plating said inner surface of said at least one hole. - View Dependent Claims (18, 19, 20)
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Specification