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Multi-step, in-situ pad conditioning system and method for chemical mechanical planarization

  • US 20050186891A1
  • Filed: 01/25/2005
  • Published: 08/25/2005
  • Est. Priority Date: 01/26/2004
  • Status: Active Grant
First Claim
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1. A method of providing an in-situ process for conditioning the surface of a polishing pad used in a chemical mechanical planarization (CMP) process, the in-situ conditioning process comprising the steps of:

  • a) processing the surface of a polishing pad to dislodge contaminants associated with the CMP process;

    b) evacuating the dislodged contaminants away from the polishing pad to prepare a cleaned polishing pad surface; and

    c) presenting the cleaned polishing pad surface for use in a subsequent planarization operation.

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